Product Overview
This radiation tolerant potting silicone includes addition curing and condensation curing formulas, designed for encapsulation, sealing, filling and pressure protection of special electronic components. It delivers outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Featuring excellent radiation resistance, it avoids colloid cracking, yellowing and circuit failure caused by long-term radiation exposure. It works stably from -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with great waterproof, dustproof, anti-corrosion and ozone-resistant performance.
Technical Specifications
This anti-radiation Silicone Encapsulant features superior radiation aging resistance and structural stability under ray irradiation. It has ultra-low volatile content and high bonding strength, maintaining complete insulation and sealing performance in high-radiation environments. It resists chemical and ozone erosion without performance degradation. Viscosity, hardness and operating time support full personalized customization for special industrial packaging demands.
Product Features & Advantages
Different from ordinary potting silicone prone to radiation aging failure, this product has unique extreme environment adaptability:
1. Professional radiation tolerance: Resists long-term ray radiation, preventing colloid aging, cracking and electronic component damage.
2. All-round protective performance: Integrates waterproof, moisture-proof, dustproof and shockproof functions with excellent chemical and ozone resistance.
3. Extreme temperature stability: Operates steadily at -60℃ to 220℃ and buffers internal thermal cycling stress effectively.
4. Universal strong adhesion: Firmly bonds various metal and non-metal substrates with low volatility and zero circuit pollution.
Application Scenarios
Widely applied in aerospace electronics, nuclear industry equipment, deep-space detection modules and radiation chamber precision instruments. Its reliable radiation tolerance greatly extends electronic service life in extreme environments, reduces equipment failure and replacement frequency, and cuts long-term operational and maintenance costs for industrial manufacturers.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to mix settled fillers completely and shake component B thoroughly before use.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable radiation-resistant performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, greatly affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global extreme environment electronic packaging and cross-border export specifications.
Customization Options
Professional customized services are available. Radiation resistance grade, hardness, viscosity and operating time can be adjusted for exclusive extreme environment packaging solutions.
Production & Quality Control
We adopt standardized production and strict radiation resistance aging testing. Pre-production formula verification and pre-shipment full inspection ensure stable anti-radiation performance and consistent batch quality.
FAQ
Q1: What is the core advantage of radiation tolerant Potting Compound ? A: It maintains stable physical and insulating performance under long-term radiation exposure, avoiding electronic aging failure in extreme working environments.
Q2: Will colloidal stratification affect radiation resistance? A: No. Slight stratification after long storage is normal, and even stirring will not weaken its radiation tolerance and protective performance.
Q3: How to store mixed radiation tolerant potting silicone? A: Seal and store raw materials in dry environments. Mixed AB silicone should be used up at one time to prevent performance attenuation.