Product Overview
This low modulus potting silicone includes addition curing and condensation curing types, specialized in flexible encapsulation, sealing, filling and buffer protection of delicate electronic components. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Its low modulus characteristic endows the cured colloid with superb flexibility, which effectively absorbs internal stress generated by high and low temperature cycling, protecting chips and gold bonding wires from cracking and damage. It also features outstanding waterproof, dustproof, anti-corrosion and ozone-resistant performance, stably operating at -60℃ to 220℃.
Technical Specifications
This low modulus Silicone Encapsulant boasts ultra-low elastic modulus and high tensile flexibility, with strong stress buffering capacity. It has ultra-low volatile content and stable structural toughness, maintaining intact flexibility and protective performance under long-term temperature alternating changes. It resists chemical erosion and ozone aging without hardening or cracking. Viscosity, hardness and operating time can be fully customized to fit diverse precision packaging requirements.
Product Features & Advantages
Different from high-modulus rigid potting silicone that easily causes component stress damage, this product has unique flexible protection advantages:
1. Low modulus & high flexibility: Buffers thermal stress and mechanical vibration, avoiding cracking damage to fragile electronic chips and wires.
2. Comprehensive protection: Integrates waterproof, moisture-proof, dustproof and shockproof functions with excellent chemical and ozone resistance.
3. Wide temperature adaptability: Maintains stable flexibility and protection in -60℃ to 220℃ extreme temperature environments.
4. Superior bonding performance: Firmly adheres to various metal and non-metal substrates with low volatility and no circuit pollution.
Application Scenarios
Ideal for precision sensors, microelectronic chips, flexible circuit boards and delicate automotive electronic modules. Its low modulus flexible protection avoids component fracture and failure caused by stress extrusion, greatly improving product stability and service life. It reduces defective rates and after-sales maintenance costs, helping manufacturers enhance product quality and market competitiveness.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable low-modulus flexibility after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global precision electronic packaging and cross-border export specifications.
Customization Options
Customized services are available. Modulus degree, hardness, viscosity and operating time can be adjusted for personalized flexible packaging solutions.
Production & Quality Control
We implement standardized production and strict modulus and flexibility testing. Pre-production verification and pre-shipment full inspection ensure stable low-modulus performance and consistent batch quality.
FAQ
Q1: What is the core benefit of low modulus potting silicone? A: Its high flexibility relieves thermal and mechanical stress, protecting fragile precision electronic components from cracking and damage.
Q2: Will colloidal stratification affect flexible performance? A: No. Slight stratification after storage is normal, and even stirring will not change its low modulus and stress relief performance.
A: Keep raw materials sealed and dry. Mixed AB silicone should be used up at one time to avoid performance degradation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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