Product Overview
This high-purity potting silicone includes addition curing and condensation curing formulas, dedicated to high-standard encapsulation, sealing, filling and shock protection of precision electronic components. It offers exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With strict impurity control, it avoids circuit corrosion and short-circuit risks caused by residual impurities. It works stably from -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with excellent dustproof, anti-corrosion and ozone-resistant performance.
Technical Specifications
This high-purity Silicone Encapsulant features ultra-low volatile content and zero ionic impurities, ensuring no contamination to precision circuits. It maintains stable physical and insulating properties under long-term high and low temperature cycling, with outstanding chemical and ozone erosion resistance. It boasts high structural strength and firm substrate adhesion. Viscosity, hardness and operating time support full customized adjustment to meet high-end electronic packaging standards.
Product Features & Advantages
Compared with ordinary impure potting silicone, this high-purity product has prominent industrial advantages:
1. Ultra-high purity: Strict impurity removal process eliminates circuit pollution, corrosion and failure risks for precision electronics.
2. Multi-dimensional protection: Integrates waterproof, moisture-proof, dustproof and shockproof functions with superior anti-aging performance.
3. Extreme temperature stability: Effectively buffers internal thermal stress to protect delicate electronic structures.
4. Reliable adhesion: Firmly bonds various metal and non-metal substrates with stable and long-lasting protective effects.
Application Scenarios
Widely applied in medical electronics, precision sensors, aerospace modules and high-end communication equipment. Its high-purity formula prevents electronic contamination and performance degradation, greatly improving product stability and service life. It effectively reduces defective rates and long-term maintenance costs, helping manufacturers enhance product grade and market competitiveness.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure high-purity curing quality.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming for flawless pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global high-purity electronic packaging and cross-border export specifications.
Customization Options
Professional customized services are available. Hardness, viscosity, operating time and purity grade can be adjusted for personalized high-precision packaging solutions.
Production & Quality Control
We adopt dust-free standardized production and strict purity testing. Pre-production sampling inspection and pre-shipment full testing ensure ultra-low impurity content and stable batch quality.
FAQ
Q1: What makes high purity Potting Compound different from ordinary ones?
A: It features ultra-low impurities and volatility, avoiding precision circuit contamination, corrosion and performance attenuation caused by residual substances.
Q2: Does colloidal stratification affect product purity? A: No. Slight storage stratification is normal, and even stirring will not change its high-purity performance and protective effect.
Q3: How to store mixed high-purity potting silicone? A: Seal and store raw materials in dry and clean environments. Mixed AB silicone should be used up at one time to avoid impurity contamination.
Shenzhen Hong Ye Jie Technology Co., Ltd
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