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Home> Products> Electronic Potting Compound> Low Exotherm Electronic Potting Compound
Low Exotherm Electronic Potting Compound
Low Exotherm Electronic Potting Compound
Low Exotherm Electronic Potting Compound
Low Exotherm Electronic Potting Compound
Low Exotherm Electronic Potting Compound
Low Exotherm Electronic Potting Compound

Low Exotherm Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-215

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound1
Product Description
HONG YE SILICONE’s Low Exotherm Electronic Potting Compound is a low heat-release Silicone Potting Compound designed for heat-sensitive electronic components. Formulated with refined liquid silicone and stable RTV 2 Silicone Rubber, it adopts mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As high-grade industrial Silicone raw materials and premium Electronic Encapsulation Adhesive, it generates minimal heat during curing, avoiding thermal damage to delicate electronics, while offering excellent insulation, waterproofing and extreme temperature resistance.
 
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Product Overview

This low exotherm potting silicone includes addition curing and condensation curing formulas, dedicated to safe encapsulation, sealing, filling and pressure protection of heat-sensitive electronic devices. It delivers outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Featuring ultra-low curing heat release, it eliminates component burnout and performance degradation caused by high exothermic reaction. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with dustproof, anti-corrosion and ozone-resistant properties.

Technical Specifications

This low exotherm Silicone Encapsulant features ultra-low heat release during full curing, with no local high temperature generation. It has ultra-low volatile content and high structural strength, maintaining stable insulation and sealing performance in extreme temperatures. It resists long-term ozone and chemical erosion without performance attenuation. Viscosity, hardness and operating time support full customization for sensitive electronic packaging needs.
 
electronic silicone

Product Features & Advantages

Superior to ordinary potting glue with fierce exothermic curing, this product has unique safety advantages:
1. Low exotherm curing: Minimal heat release during reaction, perfectly protecting heat-sensitive precision electronic components.
2. All-round protective performance: Integrates waterproof, moisture-proof, dustproof and shockproof functions with great anti-chemical and anti-ozone ability.
3. Wide temperature adaptability: Buffers internal thermal stress to stabilize electronic operation in harsh temperature environments.
4. Reliable bonding: Firmly adheres to multiple substrates with low volatility, zero pollution to precision circuits.

Application Scenarios

Widely used in precision sensors, microelectronics, delicate LED modules and heat-sensitive circuit components. Its low exotherm feature prevents thermal damage during curing, greatly reducing product defective rates. It improves packaging yield and long-term operational stability, cutting production loss and after-sales maintenance costs for electronic manufacturers.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable low exotherm curing effect.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global heat-sensitive electronic packaging and cross-border export specifications.

Customization Options

Customized services are available. Exotherm level, hardness, viscosity and operating time can be adjusted for personalized packaging solutions.

Production & Quality Control

We adopt standardized dust-free production and strict curing exotherm testing. Pre-production verification and pre-shipment full inspection ensure stable low-heat performance and consistent batch quality.

FAQ

Q1: What is the core advantage of low exotherm Potting Compound ? A: It produces little heat during curing, effectively avoiding thermal damage to heat-sensitive micro and precision electronic components.
Q2: Will colloidal stratification affect low exotherm performance? A: No. Slight storage stratification is normal, and even stirring will not change its low heat-release and protective properties.
Q3: How to store mixed low exotherm potting silicone? A: Seal and store raw materials in dry environments. Mixed AB silicone should be used up at one time to avoid performance degradation.
 
 
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