Ms. zhou

What can I do for you?

Communicate
Ms. zhou

Ms. zhou

What can I do for you?

+86 18926763719
Contact now
  • All
  • Products

Select Language

Shenzhen Hong Ye Jie Technology Co., Ltd

English

Home> Products> Electronic Potting Compound> High Bond Strength Electronic Potting Compound
High Bond Strength Electronic Potting Compound
High Bond Strength Electronic Potting Compound
High Bond Strength Electronic Potting Compound
High Bond Strength Electronic Potting Compound
High Bond Strength Electronic Potting Compound
High Bond Strength Electronic Potting Compound

High Bond Strength Electronic Potting Compound

Get Latest Price
Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Contact Now
Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9325

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
Picture Example :

The file is encrypted. Please fill in the following information to continue accessing it

Inquire the password
electronic potting compound3
Product Description
HONG YE SILICONE’s High Bond Strength Electronic Potting Compound is a strong-adhesion Silicone Potting Compound designed for firm electronic encapsulation. Made of high-purity liquid silicone and high-stability RTV 2 Silicone Rubber, it adopts mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As premium industrial Silicone raw materials, this professional Electronic Encapsulation Adhesive delivers exceptional bonding force for multiple substrates, featuring low volatility, wide temperature resistance and full environmental protection, solving poor adhesion and peeling issues of traditional potting materials.
 
package3

Product Overview

This high bond strength potting silicone includes addition curing and condensation curing formulas, dedicated to encapsulation, sealing, filling and pressure protection of various electronic components. It achieves ultra-strong adhesion and superior thermal stability on PCB, PC, PMMA, CPU, aluminum, copper and stainless steel surfaces. Cured silicone effectively absorbs thermal cycling stress to protect chips and gold bonding wires. It integrates waterproof, insulation, dustproof, shockproof, ozone and chemical corrosion resistance, ensuring long-term tight bonding and stable protection for electronic devices.

Technical Specifications

This high-adhesion Silicone Encapsulant features industry-leading bond strength with ultra-low volatile content and high structural toughness. It supports continuous stable operation in -60℃ to 220℃, maintaining permanent tight adhesion without peeling or falling off under temperature cycling and vibration. It boasts excellent anti-aging and chemical erosion resistance. Viscosity, hardness and operating time can be fully customized to fit diverse electronic packaging demands.
 
electronic silicone

Product Features & Advantages

Different from ordinary potting silicone with weak adhesion, this product owns prominent bonding advantages:
1. Ultra-high bond strength: Firmly adheres to various metal and non-metal substrates, effectively avoiding glue layer peeling and sealing failure.
2. All-round protective performance: Combines waterproof, moisture-proof, dustproof and shockproof functions with great ozone and chemical resistance.
3. Extreme temperature adaptability: Stabilizes performance in wide temperature ranges and buffers internal thermal stress effectively.
4. High purity & stability: Low volatile formula causes no pollution to precision circuits, ensuring long-term device stability.

Application Scenarios

Widely applied in automotive electronics, power modules, household electrical components and industrial control equipment that require high tightness. Its strong bonding performance prevents glue layer delamination caused by vibration and temperature changes, reduces equipment failure rates and maintenance costs, improves finished product durability and qualification rate, and brings higher economic benefits to manufacturers.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A evenly to mix settled fillers completely and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to guarantee stable high bonding performance.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global high-adhesion electronic packaging and cross-border export specifications.

Customization Options

Custom services are available. Bond strength, hardness, viscosity and operating time can be adjusted to provide exclusive packaging solutions.

Production & Quality Control

We adopt standardized production and strict adhesion testing. Pre-production verification and pre-shipment full inspection ensure stable high bond strength and consistent batch quality.

FAQ

Q1: What substrates can this high bond strength potting silicone adhere to? A: It features excellent adhesion for PCB, PC, PMMA, CPU, aluminum, copper, stainless steel and other common electronic substrates.
Q2: Will colloidal stratification affect bonding performance? A: No. Slight stratification after storage is normal, and even stirring will not weaken its adhesion and protective performance.
Q3: How to store mixed Potting Compound ? A: Seal and store raw materials in dry environments. Mixed AB silicone should be used up at one time to avoid performance loss.
Hot Products
Silicone Rubber for soft robotics
Silicone Rubber for soft robotics

Contact Now
Resin Sculpture Mold with Silicone Rubber
Resin Sculpture Mold with Silicone Rubber

Contact Now
Condensation Curing Silicone Mold for Gypsum Cornice
Condensation Curing Silicone Mold for Gypsum Cornice

Contact Now
High Quality Human Body Silicone
High Quality Human Body Silicone

Contact Now
Human Body Silicone for Life Casting Applications
Human Body Silicone for Life Casting Applications

Contact Now
Pad Printing Silicone for Children Toy
Pad Printing Silicone for Children Toy

Contact Now
Durable Electronic Encapsulation Material
Durable Electronic Encapsulation Material

Contact Now
Flexible Silicone for Pad Printing Solutions
Flexible Silicone for Pad Printing Solutions

Contact Now
High Quality Silicone Rubber for Transfer Printing
High Quality Silicone Rubber for Transfer Printing

Contact Now
Liquid Sealant Silicone for Air Purification Systems
Liquid Sealant Silicone for Air Purification Systems

Contact Now
Home> Products> Electronic Potting Compound> High Bond Strength Electronic Potting Compound
Contact Us
zhou

Ms. zhou

Leave a message
Contact Now
Recommend
Contact Now
  • Send Inquiry

Copyright © 2026 Shenzhen Hong Ye Jie Technology Co., Ltd All rights reserved. Privacy Policy

Send Inquiry
*
*

Please Leave Us A Message

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Upload Attachment
Send