Product Overview
This high dielectric potting silicone includes addition curing and condensation curing grades, dedicated to encapsulation, sealing, filling and pressure protection of high-voltage electronic devices. It delivers superior adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After curing, the flexible colloid absorbs thermal cycling stress to protect chips and gold bonding wires. It integrates ultra-high insulation, dustproof, anti-corrosion, ozone-resistant and shockproof functions, ensuring safe and stable operation of electrical equipment in complex environments.
Technical Specifications
This high dielectric Silicone Encapsulant boasts outstanding and stable dielectric insulation performance, supporting long-term stable operation at -60℃ to 220℃. It features ultra-low volatile content, high structural strength and excellent chemical erosion resistance. Its electrical insulation properties remain stable under high temperature and humid conditions. Viscosity, hardness and operating time can be fully customized to meet diverse high-voltage electronic packaging standards.
Product Features & Advantages
Compared with ordinary potting products, this high dielectric compound has unique electrical protection advantages:
1. Ultra-high dielectric insulation: Effectively isolates current, prevents electric leakage and short circuit, greatly improving high-voltage equipment safety.
2. Multi-environment resistance: Integrates waterproof, moisture-proof, dustproof and shockproof performance, resisting ozone and chemical corrosion.
3. Extreme temperature stability: Buffers thermal stress during temperature cycling and protects precision electronic internal structures.
4. Superior bonding performance: Firmly adheres to various metal and non-metal substrates with low volatility and no circuit pollution.
Application Scenarios
Specially suitable for high-voltage power modules, electrical control components, insulated circuit boards and high-precision electrical equipment. It eliminates hidden electrical safety hazards, reduces equipment failure rates caused by poor insulation, improves product safety grades, and cuts manufacturers’ maintenance and product recall costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to uniform settled fillers and thoroughly shake component B.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing and dielectric performance.
3. Vacuum defoaming: Defoam mixed uniform glue for 3 minutes under 0.01MPa vacuum before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
The product complies with ISO9001, CE and ROHS international standards, meeting global high-insulation electronic packaging and cross-border export specifications.
Customization Options
Customized services are available. Insulation grade, hardness, viscosity and operating time can be adjusted for personalized packaging solutions.
Production & Quality Control
We adopt standardized production and strict electrical performance testing. Pre-production sampling inspection and pre-shipment full testing guarantee stable high dielectric insulation and consistent batch quality.
FAQ
Q1: What scenarios is high dielectric potting silicone suitable for?
A: It is ideal for all high-voltage electronic devices that require strict insulation protection to avoid electric leakage and short-circuit risks.
Q2: Will stored stratified glue affect insulation performance?
A: No. Slight stratification is normal after long storage, and even stirring will not weaken its dielectric and protective performance.
Q3: How to store and use mixed potting glue?
A: Keep raw materials sealed and dry. Mixed AB silicone should be used up at one time to avoid performance degradation.