Ms. zhou

What can I do for you?

Communicate
Ms. zhou

Ms. zhou

What can I do for you?

+86 18926763719
Contact now
  • All
  • Products

Select Language

Shenzhen Hong Ye Jie Technology Co., Ltd

English

Home> Products> Electronic Potting Compound> Thermal Shock Resistant Electronic Potting Compound
Thermal Shock Resistant Electronic Potting Compound
Thermal Shock Resistant Electronic Potting Compound
Thermal Shock Resistant Electronic Potting Compound
Thermal Shock Resistant Electronic Potting Compound
Thermal Shock Resistant Electronic Potting Compound
Thermal Shock Resistant Electronic Potting Compound

Thermal Shock Resistant Electronic Potting Compound

Get Latest Price
Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Contact Now
Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9305

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
Picture Example :

The file is encrypted. Please fill in the following information to continue accessing it

Inquire the password
electronic potting
Product Description
HONG YE SILICONE’s Thermal Shock Resistant Electronic Potting Compound is an extreme temperature cycle resistant Silicone Potting Compound tailored for electronics with frequent temperature changes. Made of premium liquid silicone and high-stability RTV 2 Silicone Rubber, it adopts mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As high-quality Silicone raw materials, this professional Electronic Encapsulation Adhesive resists rapid cold and hot alternation, absorbing thermal expansion and contraction stress to prevent cracking and peeling, ensuring long-term stable operation of electronic devices in harsh temperature environments.
 
package4

Product Overview

This thermal shock resistant Potting Compound includes addition curing and condensation curing formulas, dedicated to encapsulation, sealing, filling and pressure protection of precision electronic components. It delivers exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. It stably operates in a wide temperature range of -60℃ to 220℃, effectively buffering strong thermal shock stress generated by rapid temperature cycling and protecting internal chips and gold bonding wires. It also integrates waterproof, insulation, dustproof, anti-corrosion and ozone-resistant multi-functional protection.
 
electronic silicone

Technical Specifications

Featuring ultra-strong thermal shock resistance, this Silicone Encapsulant maintains intact structure and stable performance after repeated extreme temperature cycles. It has ultra-low volatile content, high tensile strength and excellent chemical erosion resistance. Its physical and insulating properties will not deteriorate under drastic temperature changes. Core parameters including viscosity, hardness and operating time support full customization to meet diverse harsh working condition standards.

Product Features & Advantages

Superior to ordinary potting silicone that easily cracks under temperature alternation, this product has exclusive core advantages:
1. Outstanding thermal shock resistance: Resists rapid cold and hot cycle impact, avoiding cracking, peeling and failure caused by thermal stress.
2. Full environmental protection performance: Integrates waterproof, moisture-proof, dustproof and shockproof functions with great ozone and chemical corrosion resistance.
3. Ultra-wide temperature adaptability: Works stably in extreme low and high temperature environments without performance attenuation.
4. Reliable bonding performance: Firmly adheres to various metal and non-metal substrates with low volatility and high structural stability.

Application Scenarios

Widely used in automotive electronics, outdoor communication equipment, aerospace modules and industrial control devices with frequent temperature changes. It effectively avoids component damage and circuit failure caused by thermal shock, reduces product defective rate and after-sales maintenance costs, and greatly improves the durability and market competitiveness of electronic products.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to evenly distribute settled fillers and shake component B thoroughly before use.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable thermal shock resistance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming for flawless pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global high-standard electronic packaging and cross-border export requirements.

Customization Options

Customized services are available. Hardness, viscosity, operating time and thermal shock resistance grade can be adjusted for personalized solutions.

Production & Quality Control

We adopt standardized production and strict thermal shock cycle testing. Pre-production sampling verification and pre-shipment full inspection ensure stable and reliable batch quality.

FAQ

Q1: What is the core advantage of this thermal shock resistant potting compound?
A: It can withstand frequent extreme temperature cycles, absorb thermal stress, and prevent encapsulation layer cracking and electronic component failure.
Q2: Is stratified silicone usable after long-term storage?
A: Yes. Slight stratification is normal, and even stirring will not affect its thermal shock resistance and protective performance.
Q3: How to store mixed potting glue?
A: Store raw materials in sealed and dry environments. Mixed AB silicone should be used up at one time to avoid performance degradation.
 
 
Hot Products
Silicone Rubber for soft robotics
Silicone Rubber for soft robotics

Contact Now
Resin Sculpture Mold with Silicone Rubber
Resin Sculpture Mold with Silicone Rubber

Contact Now
Condensation Curing Silicone Mold for Gypsum Cornice
Condensation Curing Silicone Mold for Gypsum Cornice

Contact Now
High Quality Human Body Silicone
High Quality Human Body Silicone

Contact Now
Human Body Silicone for Life Casting Applications
Human Body Silicone for Life Casting Applications

Contact Now
Pad Printing Silicone for Children Toy
Pad Printing Silicone for Children Toy

Contact Now
Durable Electronic Encapsulation Material
Durable Electronic Encapsulation Material

Contact Now
Flexible Silicone for Pad Printing Solutions
Flexible Silicone for Pad Printing Solutions

Contact Now
High Quality Silicone Rubber for Transfer Printing
High Quality Silicone Rubber for Transfer Printing

Contact Now
Liquid Sealant Silicone for Air Purification Systems
Liquid Sealant Silicone for Air Purification Systems

Contact Now
Home> Products> Electronic Potting Compound> Thermal Shock Resistant Electronic Potting Compound
Contact Us
zhou

Ms. zhou

Leave a message
Contact Now
Recommend
Contact Now
  • Send Inquiry

Copyright © 2026 Shenzhen Hong Ye Jie Technology Co., Ltd All rights reserved. Privacy Policy

Send Inquiry
*
*

Please Leave Us A Message

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Upload Attachment
Send