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Home> Products> Electronic Potting Compound> Moisture Resistant Electronic Potting Silicone
Moisture Resistant Electronic Potting Silicone
Moisture Resistant Electronic Potting Silicone
Moisture Resistant Electronic Potting Silicone
Moisture Resistant Electronic Potting Silicone
Moisture Resistant Electronic Potting Silicone
Moisture Resistant Electronic Potting Silicone

Moisture Resistant Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9055

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Moisture Resistant Electronic Potting Silicone is a professional damp-proof Silicone Potting Compound engineered for electronic devices working in humid and wet environments. Formulated with high-purity liquid silicone and stable RTV 2 Silicone Rubber, it adopts mature formula technology of industrial Mold Making Silicone and Pad printing silicone rubber. As premium industrial Silicone raw materials, this versatile Electronic Encapsulation Adhesive delivers superior waterproof and moistureproof performance, paired with full insulation and temperature resistance, effectively preventing electronic failure caused by damp erosion and humidity penetration.
 
HY-factory

Product Overview

This moisture-resistant potting silicone is available in addition curing and condensation curing types, dedicated to encapsulation, sealing, filling and pressure protection of various electronic components. It features excellent adhesion and tight sealing performance for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After full curing, the flexible silicone layer effectively blocks moisture, water vapor and dust penetration. It stably operates at -60℃ to 220℃, absorbs thermal cycling internal stress, and protects chips and gold bonding wires, while resisting ozone and chemical corrosion for long-term stable protection.
 
electronic silicone

Technical Specifications

This damp-proof Silicone Encapsulant features ultra-strong moisture barrier performance with low water absorption rate. It supports continuous stable operation within -60℃~220℃, with ultra-low volatile content and high structural strength. It maintains stable insulation and sealing performance in high-humidity environments, and owns excellent ozone and chemical erosion resistance. Viscosity, hardness and operating time are fully customizable to fit diverse electronic packaging requirements.

Product Features & Advantages

Different from ordinary potting compounds with weak moisture resistance, this product has outstanding damp-proof core advantages:
1. Superior moisture & waterproof performance: Forms a tight protective layer to block water vapor and humidity penetration, avoiding short circuit and damp damage.
2. Multi-functional protection: Integrates dustproof, anti-corrosion, shockproof and insulation properties with strong ozone resistance.
3. Wide temperature adaptability: Relieves thermal stress during temperature cycling and protects precision electronic internal structures.
4. High bonding stability: Firmly adheres to multiple substrates with low volatility, no pollution to precision circuits.

Application Scenarios

Ideal for outdoor electronics, household electrical components, marine electronic modules and equipment used in humid workshops. Its reliable moisture resistance prevents electronic aging and failure caused by dampness, extends equipment service life, reduces defective rates and after-sales maintenance costs, and improves overall product stability for manufacturers.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing and moisture resistance.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global damp-proof electronic packaging and cross-border export specifications.

Customization Options

Custom services are available. Hardness, viscosity, operating time and damp-proof grade can be adjusted for personalized packaging solutions.

Production & Quality Control

We implement standardized production and strict humidity resistance testing. Pre-production verification and pre-shipment full inspection ensure stable moisture-proof performance and uniform batch quality.

FAQ

Q1: What environment is this moisture resistant potting silicone suitable for?
A: It is perfectly applicable for electronic devices used in high-humidity, damp and outdoor environments to prevent moisture erosion failure.
Q2: Will colloidal stratification affect moisture-proof performance?
A: No. Slight stratification after long storage is normal, and uniform stirring will not damage its damp-proof and protective performance.
Q3: How to store mixed moisture-resistant Potting Compound?
A: Store raw materials in sealed and dry conditions. Mixed AB silicone should be used up at one time to avoid performance attenuation.
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