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Home> Products> Electronic Potting Compound> Fast Cure Electronic Potting Compound
Fast Cure Electronic Potting Compound
Fast Cure Electronic Potting Compound
Fast Cure Electronic Potting Compound
Fast Cure Electronic Potting Compound
Fast Cure Electronic Potting Compound
Fast Cure Electronic Potting Compound

Fast Cure Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9040

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound2
Product Description
HONG YE SILICONE’s Fast Cure Electronic Potting Compound is a high-efficiency rapid curingSilicone Potting Compound tailored for high-volume electronic production. Formulated with premium liquid silicone and stable RTV 2 Silicone Rubber, it adopts mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As high-quality industrial Silicone raw materials, this Electronic Encapsulation Adhesive shortens curing cycle greatly while retaining excellent insulation, waterproof and temperature resistance, perfectly solving low-efficiency bottlenecks in mass electronic packaging.
 
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Product Overview

This fast curing Potting Compound includes addition curing and condensation curing formulas, dedicated to rapid encapsulation, sealing, filling and pressure protection of various electronic components. It delivers outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After rapid curing, the flexible colloid absorbs thermal cycling stress to protect chips and gold bonding wires. It integrates dustproof, anti-corrosion, shockproof and wide temperature resistance functions, balancing fast production efficiency and long-term component protection performance.
 
electronic silicone

Technical Specifications

Featuring optimized fast curing formula, this Silicone Encapsulant greatly shortens full curing time compared with ordinary potting glue, adaptable to room temperature and heating accelerated curing. It supports stable operation from -60℃ to 220℃, with ultra-low volatile content and high structural strength. It resists ozone and chemical erosion effectively. Viscosity, hardness and curing speed are fully customizable to match diverse mass production processes.

Product Features & Advantages

Different from conventional slow-cure potting products, this fast curing compound has prominent production advantages:
1. Rapid curing performance: Greatly accelerates molding speed, shortens production cycle and improves factory output efficiency.
2. All-round protective capability: Integrates waterproof, moisture-proof, dustproof and shockproof functions with excellent anti-aging and anti-corrosion properties.
3. Extreme temperature stability: Tolerates wide temperature fluctuations, relieves thermal stress and protects precision electronic structures.
4. High bonding stability: Firmly adheres to multiple substrates with low volatility, no pollution to precision circuits.

Application Scenarios

Widely applied in mass production of consumer electronics, communication modules, power components and industrial control circuit units. Its fast curing feature streamlines packaging procedures, reduces production waiting time, improves overall line efficiency, lowers labor and time costs, and guarantees consistent product quality for bulk orders.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to uniform settled fillers and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable fast-curing performance.
3. Vacuum defoaming: Defoam mixed glue for 3 minutes under 0.01MPa vacuum to eliminate tiny bubbles.
4. Curing treatment: Supports room temperature or heating fast curing for quick molding; ambient temperature and humidity affect curing speed.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global electronic mass production packaging and cross-border export specifications.

Customization Options

Custom services are available. Curing speed, hardness, viscosity and operating time can be adjusted to fit personalized production demands.

Production & Quality Control

We adopt standardized automated production and full-process QC testing. Pre-production formula verification and pre-shipment inspection ensure stable fast-curing performance and uniform batch quality.

FAQ

Q1: Will fast curing affect the protective performance of the potting silicone? A: No. Optimized formula ensures fast molding without sacrificing insulation, waterproof and temperature resistance performance.
Q2: Is stratified glue usable after long storage? A: Yes. Slight stratification is normal, and even stirring will not affect curing speed and protective effects.
Q3: How to store and use mixed fast cure potting compound? A: Store raw materials in sealed and dry conditions. Mixed glue should be used up promptly to avoid premature curing waste.
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