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Home> Products> Electronic Potting Compound> High Thermal Conductivity Electronic Potting Compound
High Thermal Conductivity Electronic Potting Compound
High Thermal Conductivity Electronic Potting Compound
High Thermal Conductivity Electronic Potting Compound
High Thermal Conductivity Electronic Potting Compound
High Thermal Conductivity Electronic Potting Compound
High Thermal Conductivity Electronic Potting Compound

High Thermal Conductivity Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9020

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE’s High Thermal Conductivity Electronic Potting Compound is a professional heat-dissipating Thermally Conductive Potting Compound for high-heat electronic components. Made of high-purity liquid silicone and stable RTV 2 Silicone Rubber, it adopts premium Silicone raw materials and mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. This high-performance Silicone Potting Compound integrates efficient heat conduction, insulation and waterproof performance, solving overheating failure issues of high-power electronic devices and ensuring long-term stable operation.
 
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Product Overview

This premium Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as core industrial encapsulation materials. It is dedicated to encapsulation, sealing, filling and pressure protection of high-power electronic components. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After curing, it rapidly exports internal heat, absorbs thermal cycling stress, protects chips and gold bonding wires, and delivers waterproof, dustproof, anti-corrosion and insulation protection.
 
electronic silicone

Technical Specifications

This thermally conductive Silicone Encapsulant features efficient and stable heat dissipation performance, supporting continuous operation at -60℃ to 220℃. It has ultra-low volatile content, high structural strength, and excellent resistance to ozone and chemical erosion. It maintains stable insulation and thermal conductivity in long-term high-load working environments. Viscosity, hardness and operating time can be fully customized to fit diverse high-heat electronic packaging processes.

Product Features & Advantages

Compared with ordinary potting glue, our high thermal conductivity compound has exclusive advantages for high-power electronics:
1. Efficient heat dissipation: Excellent thermal conductivity rapidly conducts and releases accumulated heat, avoiding device overheating and performance attenuation.
2. Multi-environment resistance: Integrates waterproof, moisture-proof, dustproof and shockproof functions, resisting ozone and chemical corrosion effectively.
3. Extreme temperature stability: Adaptable to -60℃~220℃ wide temperature range, relieves thermal stress and protects internal precision structures.
4. Superior bonding performance: Firmly adheres to various metal and non-metal substrates with low volatility, no circuit pollution.

Application Scenarios

Ideal for encapsulation and heat dissipation protection of high-power circuit boards, CPU modules, power supply units and heat-generating electronic components. Widely used in industrial control equipment, new energy electronics and communication devices. It effectively reduces component temperature, lowers overheating failure rates, improves product stability and service life, and cuts manufacturers’ maintenance and replacement costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to uniform settled fillers and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing and thermal conductivity.
3. Vacuum defoaming: Defoam the mixed glue for 3 minutes under 0.01MPa vacuum to eliminate tiny bubbles.
4. Curing treatment: Supports room temperature or heating curing. Full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE, UL and ROHS international standards, meeting global high-power electronic packaging and cross-border export specifications.

Customization Options

Custom services are available. Thermal conductivity, hardness, viscosity and operating time can be adjusted to meet personalized packaging demands.

Production & Quality Control

We adopt standardized production and full-process strict QC. Pre-production testing and pre-shipment full inspection guarantee stable batch thermal conductivity and consistent quality.

FAQ

Q1: Can this Potting Compound solve electronic overheating problems? A: Yes. Its high thermal conductivity efficiently dissipates concentrated heat, keeping high-power devices running at stable temperature.
Q2: Is stratified silicone usable after long storage? A: Yes. Slight stratification is normal, and even stirring will not affect heat dissipation and protective performance.
Q3: How to store and use mixed glue? A: Store raw materials in sealed and dry conditions. Mixed AB glue should be used up at one time to avoid performance degradation.
 
 
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