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Home> Products> Electronic Potting Compound> Low Outgassing Electronic Potting Compound
Low Outgassing Electronic Potting Compound
Low Outgassing Electronic Potting Compound
Low Outgassing Electronic Potting Compound
Low Outgassing Electronic Potting Compound
Low Outgassing Electronic Potting Compound
Low Outgassing Electronic Potting Compound

Low Outgassing Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9030

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE’s Low Outgassing Electronic Potting Compound is a high-purity ultra-low volatile Silicone Potting Compound designed for precision electronic and aerospace-grade packaging. Formulated with refined liquid silicone and high-stability RTV 2 Silicone Rubber, it integrates mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As premium industrial Silicone raw materials, this professional Electronic Encapsulation Adhesive features minimal outgassing, excellent insulation and wide temperature resistance, avoiding volatile contamination on precision circuits and optical components.
 
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Product Overview

This low outgassing Potting Compound includes addition curing and condensation curing grades, dedicated to encapsulation, sealing, filling and pressure protection of high-precision electronic components. It delivers outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After curing, the flexible silicone absorbs thermal cycling stress to protect chips and gold bonding wires. It also offers waterproof, dustproof, anti-corrosion and shockproof performance, ideal for strict low-volatility industrial packaging scenarios.
 
electronic silicone

Technical Specifications

This ultra-low outgassing Silicone Encapsulant features extremely low volatile content with zero residual contamination. It supports continuous operation from -60℃ to 220℃, with high structural strength and excellent resistance to ozone and chemical erosion. It maintains stable dielectric and physical properties in long-term service. Viscosity, hardness and operating time are fully customizable to fit precision electronic production standards.

Product Features & Advantages

Superior to ordinary potting products, it features core low-outgassing advantages for high-end electronics:
1. Ultra-low outgassing performance: Effectively reduces volatile precipitation, preventing fogging, contamination and signal interference on precision devices.
2. Multi-functional protection: Integrates waterproof, moisture-proof, dustproof and shockproof functions, resisting ozone and chemical corrosion.
3. Wide temperature adaptability: Relieves thermal stress during high and low temperature cycling, protecting internal precision electronic structures.
4. High bonding stability: Firmly adheres to diverse substrates with stable performance, no circuit damage or aging acceleration.

Application Scenarios

Perfect for precision electronics, aerospace devices, optical modules, high-sensitivity sensors and laboratory electronic equipment. Its low outgassing property avoids component pollution and performance drift, improves product stability and service life, reduces defective rates and rework costs, and helps manufacturers meet high-end industrial quality standards.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to uniform settled fillers and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing and low outgassing performance.
3. Vacuum defoaming: Defoam mixed glue for 3 minutes under 0.01MPa vacuum to eliminate tiny bubbles.
4. Curing treatment: Supports room temperature or heating curing. Full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global precision electronic and aerospace low-outgassing packaging specifications for export.

Customization Options

Custom services are available. Hardness, viscosity and operating time can be adjusted to match customized precision encapsulation requirements.

Production & Quality Control

We adopt standardized dust-free production and full-process strict QC. Pre-production testing and pre-shipment inspection guarantee ultra-low outgassing and stable batch quality.

FAQ

Q1: Why choose low outgassing potting compound for precision electronics? A: It minimizes volatile precipitation, effectively preventing optical pollution, signal interference and component performance degradation of high-precision devices.
Q2: Is stratified silicone usable after long storage? A: Yes. Slight stratification is normal, and uniform stirring will not affect its low outgassing and protective performance.
Q3: How to store and use mixed low outgassing potting glue? A: Store raw materials in sealed and dry environments. Mixed AB silicone should be used up at one time to avoid performance changes.
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