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Home> Products> Electronic Potting Compound> Ultra Low Viscosity Electronic Potting Compound
Ultra Low Viscosity Electronic Potting Compound
Ultra Low Viscosity Electronic Potting Compound
Ultra Low Viscosity Electronic Potting Compound
Ultra Low Viscosity Electronic Potting Compound
Ultra Low Viscosity Electronic Potting Compound
Ultra Low Viscosity Electronic Potting Compound

Ultra Low Viscosity Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9010

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Ultra Low Viscosity Electronic Potting Compound is a high-fluidity Silicone Potting Compound engineered for precision miniature electronic components. Made of premium liquid silicone and high-stability RTV 2 Silicone Rubber, it features ultra-low viscosity for seamless penetration into tiny gaps. Drawing on mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber, this professional Thermally Conductive Potting Compound delivers excellent insulation, waterproof and temperature resistance, perfectly for fine-pitch electronic encapsulation and filling protection.
 
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Product Overview

This high-performance Electronic Encapsulation Adhesive belongs to premium industrial Silicone raw materials, available in addition curing and condensation curing types. It is a multifunctional Silicone Encapsulant dedicated to electronic component sealing, filling, potting and pressure resistance. It boasts outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU and various metal substrates including aluminum and copper. After curing, the flexible colloid absorbs thermal cycling stress, protects internal chips and gold bonding wires, and integrates moistureproof, dustproof, anti-corrosion and shockproof functions to extend electronic service life.
 
electronic silicone
 

Technical Specifications

Featuring ultra-low viscosity for superior fluidity, this silicone compound enables full penetration of micro gaps without dead ends. It supports a wide operating temperature range of -60℃ to 220℃, with ultra-low volatile content and high structural strength. It resists ozone and chemical erosion effectively, with stable physical and electrical properties. Viscosity, hardness and operating time are customizable to fit diverse precision electronic packaging processes.

Product Features & Advantages

Different from ordinary potting glue, this ultra-low viscosity silicone stands out in precision electronic packaging with unique strengths:
1. Ultra-high fluidity: Effortlessly fills tiny gaps of miniature electronic components, realizing full coverage and seamless encapsulation.
2. All-round protection: Integrates waterproof, moisture-proof, dustproof, shockproof and anti-corrosion performance, adapting to complex working environments.
3. Extreme temperature stability: Tolerates -60℃ to 220℃ continuous operation, relieves thermal stress and prevents component damage from temperature cycling.
4. High bonding & low volatility: Firmly adheres to multiple substrates with few volatile substances, no pollution to precision electronic circuits.

Application Scenarios

Ideal for encapsulation of miniature electronic components, precision circuit boards, SMT devices and small electronic modules. Widely used in consumer electronics, communication equipment and industrial control electronics. It improves encapsulation integrity, reduces component failure rates, boosts production efficiency with easy pouring operation, and effectively cuts manufacturers’ production and maintenance costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to uniformize settled fillers and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing performance.
3. Vacuum defoaming: Stir mixed glue evenly and defoam for 3 minutes under 0.01MPa vacuum before pouring.
4. Curing treatment: Support room temperature or heating curing. Complete curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE, UL and ROHS international standards, meeting global precision electronic industry export and application specifications.

Customization Options

Customized services are available. Product viscosity, hardness and operating time can be adjusted to meet personalized packaging requirements.

Production & Quality Control

We adopt standardized production and full-process strict quality inspection. Pre-production testing and pre-shipment full inspection ensure stable batch quality and reliable performance.

FAQ

Q1: Why choose ultra-low viscosity Potting Compound for precision electronics? A: Its superior fluidity fills micro gaps completely, avoiding empty encapsulation and ensuring stable electronic performance.
Q2: Is stratified silicone usable after long storage? A: Yes. Slight stratification is normal, and even stirring will not affect its potting and protective performance.
Q3: How to store and use mixed glue? A: Keep raw materials sealed and dry. Mixed AB glue should be used up at one time to avoid performance deterioration.
 
 
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