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Home> Products> Electronic Potting Compound> Electronic Potting for Passive Mixer Diodes
Electronic Potting for Passive Mixer Diodes
Electronic Potting for Passive Mixer Diodes
Electronic Potting for Passive Mixer Diodes
Electronic Potting for Passive Mixer Diodes
Electronic Potting for Passive Mixer Diodes
Electronic Potting for Passive Mixer Diodes

Electronic Potting for Passive Mixer Diodes

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-215

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE’s Electronic Potting for Passive Mixer Diodes is a professional RF-grade Silicone Potting Compound customized for passive mixer diode encapsulation. Formulated with premium RTV 2 Silicone Rubber and high-purity liquid silicone , it delivers ultra-stable dielectric performance to guarantee accurate signal mixing. Adopting mature formulas of industrialMold Making Silicone and Pad printing silicone rubber, this high-performance Thermally Conductive Potting Compound provides full environmental protection, prevents signal distortion and component aging, and ensures long-term stable operation of passive mixer diode components.
 
HY-SILICONE company
 

Product Overview

This high-quality Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as reliable industrial Silicone raw materials for RF passive component packaging. It is dedicated to encapsulation, sealing, filling and pressure resistance of passive mixer diodes, featuring excellent adhesion and thermal stability for PCB, PC, PMMA and multiple metal substrates like aluminum and copper. After curing, the flexible silicone layer absorbs thermal cycling stress, protects tiny diode chips and bonding wires, and integrates waterproof, insulation, dustproof and anti-corrosion functions to stabilize RF signal mixing performance.
 
electronic silicone

Technical Specifications

This Silicone Encapsulant features a wide operating temperature range of -60℃ to 220℃, with ultra-low volatile content and high structural strength. It boasts excellent ozone and chemical erosion resistance, maintaining stable electrical parameters during long-term high-frequency signal mixing. Product viscosity, hardness and operating time are fully customizable to adapt to miniaturized passive mixer diode packaging processes and strict RF industry standards.

Product Features & Advantages

Optimized for miniature passive mixer diode components, it solves common defects such as signal mixing deviation and component damage:
1. Comprehensive protection: Integrates waterproof, moisture-proof, dustproof and shockproof performance, effectively resisting ozone and chemical corrosion.
2. Extreme temperature stability: Stably operates in -60℃ to 220℃ temperature range, relieves thermal stress and avoids diode signal instability caused by temperature changes.
3. Superior bonding performance: Firmly adheres to various substrates with high strength and low volatility, no contamination to precision diode structures.
4. Stable RF performance: Consistent insulation and dielectric properties ensure precise signal mixing without distortion or attenuation.

Application Scenarios

Specially designed for encapsulation of passive mixer diodes, RF signal mixing modules, miniature passive frequency conversion components and wireless communication circuit units. Widely applied in communication transceiver equipment and precision RF test systems. It stabilizes signal mixing accuracy, reduces component failure and rework rates, improves finished product consistency, and effectively cuts manufacturers’ production and maintenance costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B for uniform texture.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing and protective performance.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3-minute defoaming to eliminate tiny bubbles affecting precision packaging.
4. Curing treatment: Supports room temperature or heating curing. Initial curing allows subsequent processing, with full curing completed within 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

The product complies with ISO9001, CE, UL and ROHS international standards, meeting global high-frequency communication industry specifications for cross-border export and industrial-grade passive mixer diode packaging.

Customization Options

Customized services are available. Product hardness, viscosity and operating time can be adjusted to match diverse packaging processes of passive mixer diode components.

Production & Quality Control

We adopt standardized production and full-process strict QC. Pre-production sample testing and pre-shipment full inspection guarantee stable batch performance and consistent product quality.

FAQ

Q1: Will this Potting Compound affect diode signal mixing performance? A: No. It features ultra-stable dielectric properties, causing no signal distortion or frequency interference to passive mixer diodes.
Q2: Can stratified silicone be used for precision diode encapsulation? A: Slight stratification after long storage is normal. Even stirring before use will not affect encapsulation and protective performance.
Q3: How to store and use mixed potting silicone? A: Store in sealed and dry conditions. Mixed AB silicone should be used up at one time to avoid performance degradation and waste.
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