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Home> Products> Electronic Potting Compound> High Adhesion Electronic Potting Silicone
High Adhesion Electronic Potting Silicone
High Adhesion Electronic Potting Silicone
High Adhesion Electronic Potting Silicone
High Adhesion Electronic Potting Silicone
High Adhesion Electronic Potting Silicone
High Adhesion Electronic Potting Silicone

High Adhesion Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9320

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound3
Product Description
HONG YE SILICONE’s High Adhesion Electronic Potting Silicone is a high-toughness encapsulation material focused on strong substrate bonding. As a premium strong bonding protective encapsulation material and superior grip module Potting Compound, it delivers reliable secure attachment circuit board sealing. With a stable working temperature range of -60℃ to 220℃, low volatility and excellent stress resistance, it tightly bonds with various electronic substrates and metals. It prevents delamination and gap leakage, ensuring long-term intact sealing and comprehensive protection for precision electronic circuits.
 
HY-factory

Product Overview

Available in addition and condensation curing types, this high-bonding Electronic Potting Compound solves common delamination problems of traditional encapsulation materials. As a high-performance Electronic Encapsulation Adhesive, it achieves exceptional grip and sealing for PCB, PC, PMMA and CPU substrates. This professional Silicone Encapsulant inherits excellent heat dissipation performance of standard industrial Thermally Conductive Potting Compound, integrating thermal management and ultra-strong adhesion protection.

Technical Specifications

This superior grip module potting compound features high cured structural strength and ultra-stable bonding performance. It resists ozone erosion, chemical corrosion and thermal cycling stress effectively to protect chips and bonding wires. With low volatile content and no degumming risk, it maintains permanent bonding tightness. Viscosity, hardness and operating time support flexible customization for diverse sealing scenarios.
 
electronic silicone

Product Features & Advantages

1. Ultra-Strong Bonding Capacity: This strong bonding protective encapsulation material tightly adheres to multiple substrates without delamination or gaps.
2. Permanent Secure Sealing: Provides stable secure attachment circuit board sealing, avoiding leakage failure caused by poor adhesion.
3. Multi-Substrate Compatibility: The superior grip module potting compound fits PCB, plastic, acrylic and various metal materials universally.
4. All-Round Protective Performance: Integrates insulation, waterproofing, shockproof and temperature resistance while maintaining core high-adhesion advantages.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to homogenize adhesive functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure optimal bonding and curing effect.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless bonding sealing.
4. Standard Curing: Support room temperature or heating curing; full 24-hour curing forms high-strength secure attachment structure.

Application Scenarios

This high-adhesion silicone is widely used for precision circuit boards, metal-based electronic modules, acrylic encapsulated devices and multi-substrate composite electronics. It eliminates gaps and delamination risks, improves product sealing stability, reduces post-maintenance costs and enhances overall product qualification rate.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global electronic encapsulation safety and environmental specifications.

Customization Options

We support personalized adjustment of hardness, viscosity and operating time to match different high-adhesion sealing requirements.

Production Process

We adopt dust-free standardized production and strict adhesion testing. Each batch undergoes professional bonding strength tests to guarantee stable secure sealing performance.

FAQ

Q1: What is the core advantage of this potting silicone?
A: It is a strong bonding protective encapsulation material and superior grip module potting compound,
providing long-term secure attachment circuit board sealing for multi-substrate electronics.
Q2: Can it avoid delamination in long-term temperature cycling?
A: Yes. Its high-toughness bonding formula resists thermal expansion and contraction stress, maintaining
tight adhesion without delamination or cracking.
Q3: Does colloidal stratification affect adhesion performance?
A: Stratification is a normal storage phenomenon. Even stirring before use will not weaken its high-adhesion
and sealing performance.
 
 
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