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Home> Products> Electronic Potting Compound> Core Shield Electronic Encapsulant
Core Shield Electronic Encapsulant
Core Shield Electronic Encapsulant
Core Shield Electronic Encapsulant
Core Shield Electronic Encapsulant
Core Shield Electronic Encapsulant
Core Shield Electronic Encapsulant

Core Shield Electronic Encapsulant

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-215

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Low Viscosity Electronic Potting Liquid Silicone
Product Description
HONG YE SILICONE’s Core Shield Electronic Encapsulant is a high-performance dielectric strength insulating gel, durable environmental barrier casting resin and premium thermal shock resistant elastomer. It delivers reliable core protection for electronic components with -60℃ to 220℃ wide temperature adaptability. It enriches our full product lineup including standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
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Product Overview

This two-component core-grade encapsulant includes addition and condensation curing formulas. After mixing with curing agents, the liquid colloid cures firmly to realize encapsulation, sealing, filling and pressure resistance. It integrates waterproof, moisture-proof, flame-retardant and insulating functions, with excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, serving as the core protective layer for various electronic modules.

Technical Specifications

This environmental barrier casting resin adopts low-volatility, high-strength formula. Boasting outstanding dielectric strength, it insulates circuits stably and resists ozone, chemical erosion and corrosion. As a thermal shock resistant elastomer, it absorbs thermal cycling stress to protect chips and gold bonding wires. It features superior bonding on aluminum, copper and stainless steel, with customizable viscosity, hardness and operating time.
 
electronic silicone

Product Features & Advantages

1. Core Barrier Protection: This dielectric strength insulating gel provides all-round defense against dust, moisture, shock and temperature fluctuation for electronic cores.
2. Excellent Thermal Shock Resistance: Stable performance across -60℃ to 220℃ avoids component damage from frequent temperature changes.
3. Strong Multi-Material Adhesion: Tight sealing on diverse substrates and metals prevents peeling and leakage in long-term operation.
4. High Purity & Stability: Low volatile content eliminates circuit contamination, ensuring long-term stable operation of precision electronics.

Step-by-Step Application Process

1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable curing quality.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes defoaming for bubble-free pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Widely applied for core encapsulation of LED modules, consumer electronics and industrial control circuit boards. This Core Shield Electronic Encapsulant stabilizes product core performance, reduces equipment failure rates caused by environmental factors, cuts long-term maintenance costs, and improves manufacturers’ product durability and market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global electronic manufacturing safety and environmental specifications.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to match personalized core encapsulation demands.

Production Process

Adopting standardized dust-free production and strict batch testing on insulation, temperature resistance and adhesion, every batch of environmental barrier casting resin maintains consistent core protection performance.

FAQ

Q1: What is the core strength of this encapsulant?
A: It features high dielectric strength, thermal shock resistance and full environmental barrier performance,
focusing on core electronic component protection.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore original protective performance without quality loss.
Q3: Is it suitable for long-term cyclic temperature working conditions?
A: Absolutely. This thermal shock resistant elastomer effectively buffers thermal stress, ideal for long-term
cyclic temperature operation scenarios.
 
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