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Home> Products> Electronic Potting Compound> Elemental Electronic Encapsulation Compound
Elemental Electronic Encapsulation Compound
Elemental Electronic Encapsulation Compound
Elemental Electronic Encapsulation Compound
Elemental Electronic Encapsulation Compound
Elemental Electronic Encapsulation Compound
Elemental Electronic Encapsulation Compound

Elemental Electronic Encapsulation Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9305

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
 
HONG YE SILICONE’s Elemental Electronic Encapsulation Compound is a reliable foundational board sealing resin, practical primary circuit protective layer and essential basic module waterproofing agent. Tailored for fundamental electronic protection, it delivers stable insulation, thermal dissipation and environmental resistance across -60℃ to 220℃. It complements our full product portfolio including standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
package4

Product Overview

This two-component elemental-grade encapsulation compound includes addition and condensation curing formulas. As a core foundational electronic protective material, it cures rapidly after mixing with curing agents to form a sturdy protective layer. It performs excellent waterproof, moisture-proof, flame-retardant and shockproof functions, with superior adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, supporting universal electronic component encapsulation and sealing.

Technical Specifications

This foundational board sealing resin features low volatile content and high structural strength after curing. It resists ozone, chemical corrosion and dust erosion effectively. It buffers internal thermal stress generated by high-temperature cycling, protecting chips and gold bonding wires from fatigue damage. It offers stable bonding for aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time for basic module protection needs.
 
electronic silicone

Product Features & Advantages

1. Complete Basic Protection: This basic module waterproofing agent integrates insulation, heat dissipation and anti-aging performance to cover all fundamental electronic protection standards.
2. Stable Extreme Temperature Adaptability: The primary circuit protective layer maintains stable performance in -60℃ to 220℃ environments, avoiding component failure from temperature fluctuations.
3. Multi-Substrate Compatibility: It forms tight, long-lasting sealing on mainstream circuit boards and metal materials with excellent bonding strength.
4. High Safety & Purity: Low volatile formula prevents circuit contamination, ensuring long-term stable operation of basic electronic modules.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure uniform curing performance.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes defoaming to eliminate internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for foundational encapsulation of LED modules, civilian electronics and ordinary industrial control circuits. This elemental encapsulation compound standardizes basic electronic protection, reduces daily circuit failure rates, simplifies mass production material selection, and effectively cuts manufacturers’ procurement and maintenance costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global basic electronic manufacturing safety and environmental regulations.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to meet personalized foundational circuit sealing demands.

Production Process

Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, every batch of foundational board sealing resin delivers consistent and reliable basic protection performance.

FAQ

Q1: What is the core positioning of this product?
A: It is a high-stability foundational board sealing resin, specially developed for basic and
universal electronic module encapsulation.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore the original protective performance with
no quality impact.
Q3: What are its core application advantages?
A: This primary circuit protective layer features simple operation, wide compatibility and
high cost-performance, perfect for long-term mass basic electronic production.
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