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Home> Products> Electronic Potting Compound> Standard Duty Electronic Potting Silicone
Standard Duty Electronic Potting Silicone
Standard Duty Electronic Potting Silicone
Standard Duty Electronic Potting Silicone
Standard Duty Electronic Potting Silicone
Standard Duty Electronic Potting Silicone
Standard Duty Electronic Potting Silicone

Standard Duty Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9030

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s Standard Duty Electronic Potting Silicone is a reliable regular protective encapsulation material and cost-efficient general service module Potting Compound. As a versatile typical circuit sealing silicone, it delivers stable, all-round protection for conventional electronic equipment. It supports continuous operation at -60℃ to 220℃ with excellent insulation and environmental resistance. It enriches our full product range, including classic Electronic Potting Compound, heat-dissipating Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
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Product Overview

This two-component standard duty silicone potting product includes addition and condensation curing formulas, tailored for general industrial electronic encapsulation. After mixing with curing agents, the liquid colloid cures into a solid protective layer, providing waterproof, moisture-proof, flame-retardant and insulating protection. It features outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA, perfectly catering to daily sealing, filling and pressure-resistant protection of electronic components.

Technical Specifications

This typical circuit sealing silicone adopts low-volatility, high-strength formula. It boasts superior resistance to corrosion, ozone and chemical erosion. It effectively absorbs internal thermal stress caused by high-temperature cycling, protecting chips and gold bonding wires. It forms stable bonding on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and working time for diverse general service encapsulation needs.
 
electronic silicone

Product Features & Advantages

1. Balanced Standard Duty Performance: This regular protective encapsulation material integrates dustproof, shockproof, temperature-resistant and insulating functions to meet daily electronic protection standards.
2. Wide Substrate Compatibility: The general service module potting compound fits most common electronic substrates and metal materials with stable sealing performance.
3. Extreme Temperature Stability: It operates steadily in -60℃ to 220℃ environments, relieving thermal expansion and contraction damage to electronic modules.
4. High Safety & Cost-Efficiency: Low volatile content avoids component contamination, reducing production defects and overall operational costs.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure consistent curing quality.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes of defoaming to eliminate internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Widely used for encapsulation and sealing of consumer electronics, LED modules and ordinary industrial control components. This typical circuit sealing silicone stabilizes electronic product performance, reduces environmental failure risks, simplifies manufacturers’ material selection, and effectively cuts procurement and after-sales maintenance costs for mass production.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality management system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental regulations.

Customization Options

Personalized adjustment of curing hardness, colloid viscosity and operating time is available to adapt to diverse standard duty encapsulation processes.

Production Process

Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring every batch of regular protective encapsulation material delivers reliable and uniform quality.

FAQ

Q1: What is the core positioning of this product?
A: It is a cost-effective general service module potting compound, ideal for mass standard-duty
electronic encapsulation scenarios.
Q2: Can stratified colloid be used normally after storage?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
without quality loss.
Q3: Is it suitable for long-term mass production?
A: Absolutely. This typical circuit sealing silicone features stable performance and simple operation,
perfectly suitable for large-scale standardized electronic production.
 
 
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