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Home> Products> Electronic Potting Compound> Dependable Electronic Potting Silicone
Dependable Electronic Potting Silicone
Dependable Electronic Potting Silicone
Dependable Electronic Potting Silicone
Dependable Electronic Potting Silicone
Dependable Electronic Potting Silicone
Dependable Electronic Potting Silicone

Dependable Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-230

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Dependable Electronic Potting Silicone is a high-stability trustworthy protective encapsulation material and premium thermal conductive potting adhesive. As a steady consistent circuit sealing silicone, it delivers long-lasting, error-free protection for sophisticated electronic modules. It supports continuous operation at -60℃ to 220℃. It complements our full product series including standard Electronic Potting Compound, professional Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-SILICONE company

Product Overview

This two-component dependable silicone potting material includes addition and condensation curing formulas. It is a multi-functional electronic protective material featuring waterproof, moisture-proof, heat-conductive, flame-retardant and insulating performance. After mixing with curing agent, the liquid colloid cures stably to encapsulate, seal and protect precision electronic components. It exhibits excellent adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, ideal for high-reliability electronic packaging projects.

Technical Specifications

This consistent circuit sealing silicone features ultra-low volatile content and high structural strength after curing. It resists corrosion, ozone and chemical erosion effectively. It absorbs internal thermal stress caused by high-temperature cycling, protecting chips and gold bonding wires from damage. It delivers stable bonding performance on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time for diverse industrial demands.
 
electronic silicone

Product Features & Advantages

1. Ultra-Stable Protection: This trustworthy protective encapsulation material maintains consistent sealing and insulation performance in long-term cyclic temperature environments.
2. Efficient Heat Dissipation: As a professional thermal conductive potting adhesive, it accelerates internal heat emission to avoid component overheating failure.
3. Strong Environmental Adaptability: It works reliably in extreme low and high temperatures, with outstanding dustproof, shockproof and anti-aging properties.
4. High Purity & Durability: Low volatile formula prevents circuit contamination, extending the service life of electronic equipment greatly.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable curing and protection effects.
3. Vacuum Defoaming: Defoam the mixed compound under 0.01MPa vacuum for 3 minutes to remove bubbles for uniform pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Suitable for high-reliability encapsulation of precision consumer electronics, LED devices and industrial control modules. This dependable electronic potting silicone reduces circuit failure rates caused by temperature changes and environmental erosion. It stabilizes product quality, lowers after-sales maintenance costs and improves overall product competitiveness for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global high-standard electronic manufacturing requirements.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to meet personalized high-stability encapsulation needs.

Production Process

Adopting high-purity raw materials and dust-free standardized production, every batch undergoes strict stability and heat dissipation tests to guarantee reliable quality of the consistent circuit sealing silicone.

FAQ

Q1: What makes this potting silicone dependable?
A: It is a trustworthy protective encapsulation material with stable curing, consistent performance
and strong environmental adaptability for long-term use.
Q2: Does it excel in heat dissipation?
A: Yes. As a professional thermal conductive potting adhesive, it effectively dissipates internal
heat and relieves thermal cycling stress.
Q3: Can stratified glue be used normally?
A: Yes. Even stirring before use can fully restore its original stable sealing and protective
performance.
 
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