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Home> Products> Electronic Potting Compound> Standard Electronic Potting Silicone
Standard Electronic Potting Silicone
Standard Electronic Potting Silicone
Standard Electronic Potting Silicone
Standard Electronic Potting Silicone
Standard Electronic Potting Silicone
Standard Electronic Potting Silicone

Standard Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-215

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s Standard Electronic Potting Silicone is a practical general purpose protective encapsulation material and cost-effective basic module Potting Compound. As a reliableeveryday circuit sealing silicone, it delivers balanced all-round protection for conventional electronic devices. It stably operates at -60℃ to 220℃ with excellent insulation and environmental resistance. It enriches our full product portfolio alongside classic Electronic Potting Compound, heat-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrialSilicone Encapsulant.
 
package3

Product Overview

This two-component standard grade silicone potting material includes addition and condensation curing formulas, tailored for universal daily electronic encapsulation. Mixed with curing agent, the liquid colloid cures firmly to realize encapsulation, sealing, filling and pressure resistance protection for electronic components. It features premium waterproof, moisture-proof, flame-retardant and insulating properties, with outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, perfectly fitting mass conventional electronic production.

Technical Specifications

This everyday circuit sealing silicone adopts low-volatility, high-strength formula. It boasts excellent corrosion resistance, ozone resistance and chemical erosion resistance. It effectively absorbs internal thermal stress caused by high-temperature cycling to protect chips and gold bonding wires. It forms stable bonding on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time to meet diverse basic encapsulation demands.
 
electronic silicone

Product Features & Advantages

1. Balanced Basic Performance: This general purpose protective encapsulation material integrates dustproof, shockproof, temperature-resistant and insulating functions to cover daily electronic protection needs.
2. Wide Versatile Compatibility: The basic module potting compound adapts to most common electronic substrates and metal materials with stable sealing effects.
3. Extreme Temperature Stability: It supports long-term operation in -60℃ to 220℃ environments, relieving thermal expansion and contraction damage.
4. High Cost-Performance: Simple operation and stable curing quality reduce production defect rates and overall procurement costs for manufacturers.

Step-by-Step Usage Process

1. Pre-Mixing Preparation: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure consistent curing performance.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes of defoaming to remove internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Widely used for encapsulation and sealing of consumer electronics, LED modules and ordinary industrial control components. This everyday circuit sealing silicone stabilizes product performance, reduces circuit failure caused by harsh environments, simplifies material selection for mass production, and effectively cuts production and after-sales maintenance costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality management system, CE and RoHS international standards, meeting global conventional electronic manufacturing safety requirements.

Customization Options

Personalized adjustment of curing hardness, colloid viscosity and operating time is available for customized basic encapsulation processes.

Production Process

Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring every batch of general purpose protective encapsulation material delivers reliable and consistent quality.

FAQ

Q1: What is the core advantage of Standard Electronic Potting Silicone?
A: It is a cost-efficient basic module potting compound with stable performance, ideal for daily
and mass conventional electronic encapsulation.
Q2: Can stratified colloid after long storage be used normally?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
without quality loss.
Q3: Is it suitable for multi-substrate electronic modules?
A: Absolutely. This everyday circuit sealing silicone has excellent compatibility with mainstream
plastics and metal substrates for versatile use.
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