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Home> Products> Electronic Potting Compound> Core Series Electronic Potting Silicone
Core Series Electronic Potting Silicone
Core Series Electronic Potting Silicone
Core Series Electronic Potting Silicone
Core Series Electronic Potting Silicone
Core Series Electronic Potting Silicone
Core Series Electronic Potting Silicone

Core Series Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9035

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE’s Core Series Electronic Potting Silicone is a high-performance essential protective encapsulation material and industry-standard primary module Potting Compound. As a core-grade fundamental circuit sealing silicone, it delivers stable, long-lasting protection for mainstream electronic modules. It operates steadily at -60℃ to 220℃ with outstanding insulation and anti-aging performance. It complements our full product portfolio including classic Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrialSilicone Encapsulant.
 
HY-SILICONE company

Product Overview

This two-component core series silicone potting material includes addition and condensation curing formulas, serving as the core foundational encapsulation solution for electronic manufacturing. After mixing with curing agents, liquid colloid cures rigidly to realize encapsulation, sealing, filling and pressure resistance. It integrates waterproof, flame-retardant, heat-dissipating and insulating properties, with excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates for universal electronic protection.

Technical Specifications

This fundamental circuit sealing silicone features low volatile content and high structural strength after curing. It resists corrosion, ozone and chemical erosion effectively. It absorbs internal thermal cycling stress to protect chips and gold bonding wires from fatigue damage. It provides reliable bonding for aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time for diverse core production needs.
 
electronic silicone

Product Features & Advantages

1. Core-Grade Comprehensive Protection: This essential protective encapsulation material integrates dustproof, shockproof, temperature-resistant and insulating functions to cover core electronic protection standards.
2. Universal Module Adaptability: The primary module potting compound fits most mainstream electronic modules and substrate materials with stable sealing performance.
3. Extreme Temperature Endurance: It supports continuous operation in -60℃ to 220℃ environments, eliminating thermal expansion and contraction risks.
4. High Purity & Stability: Low impurity formula avoids circuit contamination, ensuring long-term stable operation of electronic equipment.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure consistent curing quality.
3. Vacuum Defoaming: Defoam mixed colloid under 0.01MPa vacuum for 3 minutes to remove bubbles for flawless pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing completes in 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for core encapsulation of LED devices, precision consumer electronics and standard industrial control modules. This fundamental circuit sealing silicone stabilizes product quality, reduces circuit failure rates caused by harsh environments, unifies material selection standards, and effectively cuts production and after-sales maintenance costs for manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global core electronic manufacturing safety and environmental specifications.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to meet personalized core module encapsulation processes.

Production Process

Adopting standardized dust-free production and strict batch performance testing, every batch of primary module potting compound undergoes full inspection on adhesion, temperature resistance and curing stability to guarantee reliable core quality.

FAQ

Q1: What makes Core Series potting silicone different?
A: It is an essential protective encapsulation material with upgraded core stability, designed
for mainstream mass electronic production.
Q2: Is stratified glue usable after long storage?
A: Yes. Even stirring can fully restore its original sealing and protective performance with
no quality impact.
Q3: Is it suitable for precision core electronic components?
A: Absolutely. This fundamental circuit sealing silicone features low volatility and high stability,
perfect for precision core module protection.
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