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Home> Products> Electronic Potting Compound> Classic Electronic Potting Compound
Classic Electronic Potting Compound
Classic Electronic Potting Compound
Classic Electronic Potting Compound
Classic Electronic Potting Compound
Classic Electronic Potting Compound
Classic Electronic Potting Compound

Classic Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-210

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s Classic Electronic Potting Compound is a mature time tested protective encapsulation material and reliable proven module Potting Compound. With long-term market verification, this Classic Electronic Potting Compound Proven delivers stable, durable circuit protection for general electronic devices. It works steadily at -60℃ to 220℃ with excellent insulation and anti-corrosion performance. It matches our full product lineup including standard Electronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-factory

Product Overview

This classic two-component silicone potting material includes addition and condensation curing formulas, serving as a mature and cost-effective electronic protection solution. After mixing with curing agents, the liquid silicone cures firmly to seal, fill and protect electronic components. It integrates waterproof, moisture-proof, flame-retardant and insulating functions, featuring outstanding adhesion and thermal stability on PCB, CPU, PC, PMMA and multiple metal substrates for universal electronic encapsulation.

Technical Specifications

This time tested protective encapsulation material adopts low-volatility and high-strength formula. It boasts excellent resistance to corrosion, ozone and chemical erosion. It effectively absorbs thermal cycling stress inside encapsulated modules to protect chips and gold bonding wires. It features stable bonding on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time for diverse industrial needs.

Product Features & Advantages

1. Mature & Stable Performance: As a proven module potting compound, it has passed long-term market and industrial verification with zero unstable quality issues.
2. Full-Round Environmental Resistance: It resists extreme high and low temperatures, dust, vibration and chemical corrosion for long-lasting electronic protection.
3. Superior Substrate Compatibility: It forms tight and durable sealing layers on various electronic substrates and metal materials with strong adaptability.
4. High Safety & Cost-Efficiency: Low volatile ingredients avoid component contamination, lowering production defect rates and after-sales costs.
 
electronic silicone

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable curing performance.
3. Vacuum Defoaming: Place mixed colloid in a vacuum container and defoam at 0.01MPa for 3 minutes to eliminate internal bubbles.
4. Standard Curing: Cure via room temperature or heating mode; full curing completes in 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for encapsulation, sealing, filling and pressure resistance protection of LED equipment, consumer electronics and ordinary industrial control modules. This Classic Electronic Potting Compound Proven stabilizes product quality, reduces circuit failure risks caused by harsh environments, simplifies material selection for manufacturers, and effectively cuts procurement and maintenance costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental specifications.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to meet personalized encapsulation process requirements.

Production Process

Produced with standardized dust-free production procedures and strict batch performance tests, ensuring every batch of proven module potting compound maintains consistent and reliable mature quality.

FAQ

Q1: What is the core strength of this classic potting compound?
A: It is a time tested protective encapsulation material with mature formula, stable performance and
wide applicability for mass production.
Q2: Is stratified colloid after storage usable?
A: Yes. Even stirring can fully restore its original performance without affecting sealing and protective
effects.
Q3: Why choose classic series potting silicone?
A: Classic Electronic Potting Compound Proven delivers verified stable quality, lower failure rate and
higher cost-performance for long-term mass production.
 
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