Product Overview
This two-component Solid Shield potting silicone includes addition and condensation curing formulas. It is a high-performance electronic protective material integrating waterproof, flame-retardant, insulating and heat-dissipating functions. After mixing with curing agent, the liquid silicone cures into a tough solid layer, realizing effective encapsulation, sealing, filling and pressure resistance. It offers exceptional adhesion and thermal stability on PCB, CPU, PC, PMMA and multiple metal substrates for heavy-duty electronic protection. Technical Specifications
This resilient circuit sealing silicone adopts low-volatility, high-toughness formula. It features excellent corrosion, ozone and chemical erosion resistance. It absorbs thermal cycling stress inside encapsulated modules to protect chips and gold bonding wires. It provides firm bonding for aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time to fit diverse harsh working environments.
Product Features & Advantages
1. Superior Structural Toughness: This robust protective encapsulation material forms a rigid protective layer to resist external pressure, vibration and mechanical impact.
2. Extreme Weather Resilience: The durable module potting compound maintains stable performance under ultra-low and high temperature alternating cycles.
3. Multi-Environment Defense: It effectively prevents dust, moisture and chemical erosion, achieving long-term stable circuit protection.
4. High Purity & Strong Adhesion: Low volatile content avoids component pollution, while excellent substrate adhesion prevents peeling and failure
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to uniform settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure full curing and structural toughness.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes defoaming to remove internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Ideal for heavy-duty encapsulation of industrial control modules, outdoor LED equipment and high-stability electronic devices. This resilient circuit sealing silicone greatly reduces equipment failure rates in harsh environments, extends product service life, lowers manufacturers’ replacement and maintenance costs, and improves overall product durability and market competitiveness.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international environmental standards, meeting global industrial electronic manufacturing specifications.
Customization Options
Customizable curing hardness, colloid viscosity and operating time are available to meet personalized heavy-duty encapsulation requirements.
Production Process
Produced with high-purity raw materials and standardized dust-free production. Every batch undergoes strict toughness, temperature resistance and adhesion tests to ensure stable quality of the durable module potting compound.
FAQ
Q1: What is the core advantage of Solid Shield potting silicone?
A: It is a robust protective encapsulation material with high toughness and strong environmental
adaptability, specially designed for harsh working conditions.
Q2: Is stratified colloid usable after long storage?
A: Yes. Even stirring can fully restore its original performance without affecting sealing and
protective effects.
Q3: Is it suitable for outdoor electronic equipment?
A: Absolutely. This resilient circuit sealing silicone features ozone and weather resistance,
perfect for long-term outdoor electronic protection.