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Home> Products> Electronic Potting Compound> Standard Potting Electronic Silicone Compound
Standard Potting Electronic Silicone Compound
Standard Potting Electronic Silicone Compound
Standard Potting Electronic Silicone Compound
Standard Potting Electronic Silicone Compound
Standard Potting Electronic Silicone Compound
Standard Potting Electronic Silicone Compound

Standard Potting Electronic Silicone Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9310

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s Standard Potting Electronic Silicone Compound is a reliable basic protective encapsulation material and cost-effective regular module Potting Compound. As a classic common circuit sealing silicone, it delivers stable all-round protection for general electronic devices. It stably operates at -60℃ to 220℃ with excellent insulation and temperature resistance. It matches our full product lineup, including professional Electronic Potting Compound, heat-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
package3

Product Overview

This standard two-component potting silicone includes addition and condensation curing formulas, serving as a mainstream electronic protection material for general industrial use. The liquid compound cures rapidly after mixing with curing agents, forming a firm protective layer for electronic components. It features premium waterproof, moisture-proof, flame-retardant and insulating properties, with outstanding adhesion and thermal stability on PCB, CPU, PC, PMMA and multiple metal substrates for universal electronic encapsulation.

Technical Specifications

This common circuit sealing silicone adopts high-purity formula with low volatile content and high structural strength after curing. It boasts excellent corrosion resistance, ozone resistance and chemical erosion resistance. It effectively absorbs thermal cycling stress inside encapsulated modules to protect chips and gold bonding wires. It features strong bonding performance on aluminum, copper and stainless steel, with customizable viscosity, hardness and operating time for diverse standard potting demands.
 
electronic silicone

Product Features & Advantages

1. Standard Stable Performance: This basic protective encapsulation material maintains consistent protective effects in conventional working environments, suitable for mass standardized production.
2. Multi-Substrate Compatibility: The regular module potting compound achieves tight sealing and stable adhesion on various electronic substrates and metal materials.
3. Extreme Temperature Adaptability: It supports long-term operation in -60℃ to 220℃ environments, effectively relieving internal thermal stress of electronic modules.
4. High Safety & Durability: Low volatile ingredients avoid component contamination, while excellent shockproof and dustproof performance extends electronic product service life.

Step-by-Step Usage Process

1. Pre-Mixing Preparation: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure stable curing and protective performance.
3. Vacuum Defoaming: Place evenly mixed colloid in a vacuum container and defoam at 0.01MPa for 3 minutes before pouring.
4. Standard Curing: Cure via room temperature or heating mode; full curing takes 24 hours, and ambient temperature and humidity will affect curing speed.

Application Scenarios & Commercial Value

Ideal for encapsulation, sealing, filling and pressure resistance protection of common electronic components, LED equipment and ordinary industrial control modules. This standard potting silicone reduces circuit failure risks caused by moisture, dust and temperature changes. It simplifies material selection for manufacturers, lowers procurement and maintenance costs, and improves overall product yield and market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental requirements.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to meet personalized standard potting and encapsulation needs.

Production Process

Produced with standardized dust-free production procedures and high-purity raw materials. Every batch undergoes strict performance tests on adhesion, temperature resistance and curing stability to ensure reliable and consistent quality.

FAQ

Q1: What are the core strengths of Standard Potting Electronic Silicone Compound?
A: It is a cost-efficient regular module potting compound with stable performance and wide
compatibility for general electronic sealing.
Q2: Can stratified colloid be used normally?
A: Yes. Stir evenly before use, and the basic protective encapsulation material will restore full
performance without quality impact.
Q3: Is it suitable for mass electronic production?
A: Absolutely. It features simple operation, stable curing and high consistency, perfectly fitting
mass standardized encapsulation production.
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