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Home> Products> Electronic Potting Compound> Premium General Purpose Electronic Potting Compound
Premium General Purpose Electronic Potting Compound
Premium General Purpose Electronic Potting Compound
Premium General Purpose Electronic Potting Compound
Premium General Purpose Electronic Potting Compound
Premium General Purpose Electronic Potting Compound
Premium General Purpose Electronic Potting Compound

Premium General Purpose Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9320

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s Premium General Purpose Electronic Potting Compound is a high-end high quality protective encapsulation material and industrial-grade dependable circuit sealing silicone. As a premium reliable silicone circuit sealant material, it delivers all-round stable protection for diversified electronic devices. It supports long-term stable operation at -60℃ to 220℃. It complements our full product series including standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-factory

Product Overview

This two-component premium general-purpose silicone potting product includes addition and condensation curing formulas. It is a multi-functional electronic protective material integrating waterproof, moisture-proof, heat-conductive, flame-retardant and insulating properties. After mixing with curing agent, the liquid silicone cures firmly to encapsulate and protect precision electronic components. It exhibits excellent adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, suitable for diverse high-standard general electronic packaging scenarios.

Technical Specifications

This dependable circuit sealing silicone features ultra-low volatile content and high mechanical strength after curing. It boasts outstanding resistance to corrosion, ozone and chemical erosion. It effectively absorbs internal thermal stress caused by high-temperature cycling, protecting chips and gold bonding wires. It forms tight and durable bonding on aluminum, copper, stainless steel and other metals, with customizable viscosity, curing hardness and operating time.
 
electronic silicone

Product Features & Advantages

1. Premium Comprehensive Performance: This high quality protective encapsulation material upgrades basic protection with stronger stability and anti-aging performance than ordinary potting glue.
2. Wide Universal Adaptability: The reliable silicone circuit sealant material fits multiple substrates and electronic modules, meeting diverse general-purpose encapsulation demands.
3. Extreme Temperature Resistance: It operates continuously from -60℃ to 220℃, relieving thermal expansion and contraction stress to avoid component damage.
4. High Purity & Stability: Low volatile ingredients prevent circuit contamination, ensuring long-term stable operation of electronic equipment.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to guarantee premium curing and sealing performance.
3. Vacuum Defoaming: Place mixed colloid in a vacuum container and defoam at 0.01MPa for 3 minutes to remove internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Suitable for high-standard encapsulation, sealing and shockproof protection of consumer electronics, LED equipment, industrial control modules and precision general electronic components. It effectively reduces circuit failure rates, extends product service life, unifies material selection standards for manufacturers, cuts procurement costs and improves product market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products strictly comply with ISO9001 quality management system, CE and RoHS international environmental safety standards, meeting global high-end electronic manufacturing specifications.

Customization Options

Personal customization of curing hardness, colloid viscosity and operating time is available to meet personalized premium encapsulation requirements.

Production Process

Adopting high-purity raw materials and dust-free standardized production, every batch undergoes strict performance testing to ensure stable and premium quality of the reliable silicone circuit sealant material.

FAQ

Q1: What is the advantage of premium general-purpose potting silicone?
A: It is a high quality protective encapsulation material with upgraded stability and wide compatibility,
superior to ordinary general-grade products.
Q2: Does long-term storage affect product performance?
A: Slight colloid stratification may occur, but even stirring can fully restore the dependable circuit
sealing silicone’s original performance.
Q3: Is it suitable for precision electronic product packaging?
A: Yes. Its low volatility and high stability make it ideal for precision general electronic
encapsulation and sealing protection.
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