Product Overview
This two-component everyday-grade silicone potting material includes addition and condensation curing formulas, designed for daily electronic encapsulation demands. After mixing with curing agents, the liquid silicone cures firmly to realize encapsulation, sealing, filling and pressure resistance. It integrates waterproof, moisture-proof, insulating and heat-dissipating functions, with excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, ideal for mass conventional electronic production. Technical Specifications
This daily circuit sealing silicone adopts low-volatility, high-strength formula. It boasts outstanding resistance to corrosion, ozone and chemical erosion. It effectively absorbs internal thermal stress caused by high-temperature cycling to protect chips and gold bonding wires. It forms stable bonding on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time for diverse daily production needs.
Product Features & Advantages
1. Practical All-Round Protection: This routine protective encapsulation material covers daily electronic protection needs including dustproof, shockproof, temperature resistance and insulation.
2. Strong Universal Compatibility: The common module potting compound fits most mainstream electronic substrates and metal materials with stable sealing performance.
3. Stable Extreme Temperature Performance: It runs continuously at -60℃ to 220℃, relieving thermal expansion and contraction damage to electronic modules.
4. High Cost-Performance: Simple operation and low impurity content reduce production defect rates and overall procurement costs for manufacturers.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure stable curing quality.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes of defoaming for bubble-free pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely applied for encapsulation and sealing of civilian electronics, daily LED products and ordinary industrial control modules. This daily circuit sealing silicone standardizes basic electronic protection, effectively reduces daily equipment failure rates, simplifies material selection for mass production, and lowers long-term production and maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global conventional electronic manufacturing safety and environmental requirements.
Customization Options
Personalized adjustment of curing hardness, colloid viscosity and operating time is available to adapt to diverse daily encapsulation processes.
Production Process
Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring every batch of routine protective encapsulation material maintains consistent and reliable quality.
FAQ
Q1: What is the main application of this product?
A: It is a cost-efficient common module potting compound, specially developed for daily and
mass conventional electronic encapsulation scenarios.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
without quality loss.
Q3: Why choose Everyday Electronic Potting Silicone?
A: This daily circuit sealing silicone features stable basic performance, easy operation and high
cost-performance, perfect for long-term mass daily production.