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Home> Products> Electronic Potting Compound> Basic Electronic Potting Silicone
Basic Electronic Potting Silicone
Basic Electronic Potting Silicone
Basic Electronic Potting Silicone
Basic Electronic Potting Silicone
Basic Electronic Potting Silicone
Basic Electronic Potting Silicone

Basic Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound2
Product Description
 
HONG YE SILICONE’s Basic Electronic Potting Silicone is a cost-efficient entry level module Potting Compound and practical simple circuit sealing silicone. This reliable Electronic Potting Compound Basic Grade delivers fundamental and stable protection for general electronic components. It features wide temperature resistance ranging from -60℃ to 220℃. It enriches our full product lineup alongside standard Electronic potting compound, heat-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-factory

Product Overview

This two-component basic-grade silicone potting material includes addition and condensation curing formulas, serving as an entry-level encapsulation solution for general electronic manufacturing. Mixed with curing agents, the liquid colloid cures steadily to complete encapsulation, sealing, filling and pressure resistance protection. It integrates waterproof, moisture-proof, insulating and heat-dissipating properties, with excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates for daily electronic protection.

Technical Specifications

This simple circuit sealing silicone adopts low-volatility and high-strength formula. It resists corrosion, ozone and chemical erosion effectively, and absorbs internal thermal stress caused by high-temperature cycling to protect chips and gold bonding wires. It maintains stable performance in extreme temperature environments and forms durable bonding on aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support personalized adjustment.
 
electronic silicone

Product Features & Advantages

1. Complete Basic Protection: This entry level module potting compound integrates dustproof, shockproof, temperature-resistant and insulating functions to meet basic electronic protection demands.
2. Wide Substrate Compatibility: The Electronic Potting Compound Basic Grade fits most common electronic substrates and metal materials with stable sealing effects.
3. Stable Temperature Adaptability: It supports continuous operation at -60℃ to 220℃, relieving thermal expansion and contraction damage to electronic modules.
4. High Cost-Performance: With simple operation and low impurity content, it effectively reduces mass production costs while ensuring stable product quality.

Step-by-Step Usage Process

1. Pre-Mixing Preparation: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to guarantee stable curing performance.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes of defoaming to remove internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, greatly affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Widely applicable for encapsulation and sealing of ordinary consumer electronics, LED modules and basic industrial control components. This simple circuit sealing silicone simplifies manufacturers’ material selection, reduces daily circuit failure rates, lowers production defect and maintenance costs, and improves overall product market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global basic electronic manufacturing safety and environmental requirements.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to match diverse basic electronic encapsulation processes.

Production Process

Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring every batch of entry level module potting compound delivers consistent and reliable basic performance.

FAQ

Q1: What is the positioning of Basic Electronic Potting Silicone?
A: It is a high-cost-performance Electronic Potting Compound Basic Grade, ideal for mass basic
electronic encapsulation and daily circuit sealing scenarios.
Q2: Can stratified colloid after long storage be used normally?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
without quality loss.
Q3: Is it suitable for beginner-level production operations?
A: Absolutely. This simple circuit sealing silicone features simple mixing and curing process, friendly
for mass basic production operations.
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