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Home> Products> Electronic Potting Compound> General Fill Electronic Potting Compound
General Fill Electronic Potting Compound
General Fill Electronic Potting Compound
General Fill Electronic Potting Compound
General Fill Electronic Potting Compound
General Fill Electronic Potting Compound
General Fill Electronic Potting Compound

General Fill Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9305

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s General Fill Electronic Potting Compound is a high-performance standard application protective encapsulation material and versatile universal module Potting Compound. As a practical common use circuit sealing silicone, it delivers stable filling and sealing protection for most ordinary electronic devices. It supports long-term operation at -60℃ to 220℃ with excellent insulation and anti-aging performance. It complements our full product series includingElectronic potting compound, Thermally Conductive Potting Compound, Electronic Encapsulation Adhesive and Silicone Encapsulant.
 
HY-silicone term

Product Overview

This two-component silicone potting product includes addition and condensation curing types, designed for universal electronic filling and encapsulation. It serves as a core protective material with waterproof, moisture-proof, heat-conductive, flame-retardant and insulating properties. After mixing with curing agent, the liquid silicone cures firmly to encapsulate and protect precision electronic components. It features outstanding adhesion and thermal stability on PCB, CPU, PC, PMMA and multiple metal materials, perfectly fitting standard electronic packaging demands.

Technical Specifications

This common use circuit sealing silicone boasts low volatile content and high structural strength after curing. It features excellent corrosion resistance, ozone resistance and chemical erosion resistance. It absorbs internal thermal stress caused by temperature cycling to protect chips and gold bonding wires. It forms tight sealing layers on aluminum, copper, stainless steel and other metals, with customizable viscosity, curing hardness and working time for diverse standard applications.
 
electronic silicone

Product Features & Advantages

1. Universal Filling Performance: This standard application protective encapsulation material achieves full and uniform filling without dead corners for most conventional electronic modules.
2. Multi-Environment Resistance: The universal module potting compound resists extreme high and low temperatures, dust, vibration and chemical corrosion for long-term stable protection.
3. Superior Adhesion & Stability: It forms durable bonding on various substrates, avoiding peeling or failure in daily service environments.
4. High Purity & Safety: Low volatile ingredients prevent electronic component contamination, ensuring stable and safe operation of circuit systems.

Step-by-Step Usage Process

1. Preprocessing: Fully stir component A to disperse settled fillers and shake component B evenly before operation.
2. Proportion Mixing: Mix A and B components strictly according to standard weight ratio to guarantee stable curing and filling performance.
3. Vacuum Defoaming: Place the mixed colloid in a vacuum container at 0.01MPa for 3 minutes of defoaming to remove internal bubbles.
4. Curing Treatment: Cure at room temperature or heated condition; full curing completes in 24 hours, with ambient temperature and humidity affecting curing efficiency.

Application Scenarios & Commercial Value

Widely applied for encapsulation, sealing, filling and pressure resistance protection of common electronic components, LED equipment and industrial circuit modules. It effectively reduces circuit failure rates caused by moisture, dust and temperature changes, improving product qualification rate and service life. Its universal applicability simplifies material selection, cuts procurement costs and elevates overall product quality for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE silicone products comply with ISO9001 quality management system, CE and RoHS international environmental standards, meeting global mainstream electronic manufacturing specifications.

Customization Options

We support personalized adjustment of curing hardness, colloid viscosity and operating time to meet customized filling and encapsulation requirements for different electronic products.

Production Process

Adopting purified raw materials and standardized dust-free production processes, every batch undergoes strict performance testing for viscosity, curing effect and environmental resistance, ensuring stable and consistent product quality.

FAQ

Q1: What makes this general fill potting silicone different?
A: It is a cost-effective universal module potting compound with balanced performance, ideal for mass
standard electronic encapsulation projects.
Q2: Will colloidal stratification affect filling performance?
A: No. Even if stratification occurs after long-term storage, uniform stirring can restore its original
performance completely.
Q3: Is this product suitable for metal and plastic circuit substrates?
A: Yes. This standard application protective encapsulation material has excellent adhesion to metals,
PC and PMMA substrates for versatile use.
 
 
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