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Home> Products> Electronic Potting Compound> Value Series Electronic Potting Compound
Value Series Electronic Potting Compound
Value Series Electronic Potting Compound
Value Series Electronic Potting Compound
Value Series Electronic Potting Compound
Value Series Electronic Potting Compound
Value Series Electronic Potting Compound

Value Series Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound3
Product Description
HONG YE SILICONE’s Value Series Electronic Potting Compound is a premium cost effective protective encapsulation material and budget-friendly affordable module Potting Compound. As a high-performance economical circuit sealing silicone, it balances reliable protection and low operational costs. It stably operates at -60℃ to 220℃ with excellent insulation and anti-corrosion ability. It complements our full product range including standard Electronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
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Product Overview

This two-component Value Series potting compound includes addition and condensation curing formulas, tailored for cost-sensitive mass electronic manufacturing. After mixing with curing agents, the liquid colloid cures firmly to realize encapsulation, sealing, filling and pressure resistance for electronic components. It features waterproof, flame-retardant, heat-dissipating and insulating properties, with outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA substrates.
 
electronic silicone

Technical Specifications

This economical circuit sealing silicone adopts low-volatility, high-strength formula. It resists ozone, chemical erosion and corrosion effectively. It absorbs thermal cycling stress inside modules to protect chips and gold bonding wires. It delivers stable bonding on aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support customized adjustment to fit diverse production needs.

Product Features & Advantages

1. High Cost-Performance: This cost effective protective encapsulation material maintains industrial-grade protection while lowering overall procurement costs.
2. Multi-Environment Resistance: The affordable module potting compound provides full defense against dust, moisture, vibration and extreme temperatures.
3. Strong Substrate Adaptability: It achieves tight, long-lasting sealing on mainstream electronic substrates and various metal materials.
4. Stable Long-Term Performance: Low volatile content prevents component contamination, ensuring durable and consistent circuit protection.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable curing quality.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for smooth pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, influenced by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for mass encapsulation of LED devices, consumer electronics and ordinary industrial control modules. This economical circuit sealing silicone stabilizes product quality, reduces circuit failure and maintenance costs, simplifies bulk production material selection, and greatly improves manufacturers’ market cost competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental regulations.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to meet personalized mass production encapsulation demands.

Production Process

Adopting standardized dust-free production and strict batch performance testing, every batch of cost effective protective encapsulation material undergoes full quality inspection to ensure stable mass production performance.

FAQ

Q1: What is the core advantage of Value Series potting compound?
A: It is an affordable module potting compound with balanced performance and cost, perfect for
large-scale standardized electronic encapsulation.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
with no quality impact.
Q3: Is it suitable for long-term bulk production?
A: Absolutely. This economical circuit sealing silicone features stable quality and simple operation,
ideal for long-term cost-effective mass manufacturing.
 
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