Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high thermal conductivity 2-component Addition Curing Silicone, featuring excellent thermal conductivity (1.5-3.0 W/(m·K)), efficient heat dissipation, uniform heat transfer, no heat accumulation. It has fine uniform pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS certification, compatible with Electronic Potting Compound and high-temperature insulation silicone, serving B2B buyers in thermal management scenarios.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high thermal conductivity core product, focusing on efficient thermal management and heat dissipation. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with high thermal conductivity fillers, featuring excellent thermal conductivity, fine uniform pore structure, good elasticity and stable heat transfer performance, which can quickly transfer and dissipate heat, avoid heat accumulation. Compatible with most of our core products, it is ideal for electronic, industrial and high-power equipment thermal management, filling and heat dissipation.
Technical Specifications
Type: 2-component addition curing silicone
Thermal Conductivity: 1.5-3.0 W/(m·K), efficient heat dissipation, uniform heat transfer
Foaming Feature: Fine uniform pores (40-90μm), thermal conductive, no heat accumulation
Temperature Range: -65℃ to 200℃ (long-term use), 250℃ short-term use
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS
Key Traits: High thermal conductivity, efficient heat dissipation, uniform heat transfer, thermal management
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Thermal Conductivity: Thermal conductivity up to 1.5-3.0 W/(m·K), much higher than traditional foaming silicone (0.2-0.5 W/(m·K)), efficient heat transfer and dissipation, quickly guiding heat away from high-heat components, solving the problem of traditional foaming materials’ poor thermal conductivity and heat accumulation.
2. Uniform Heat Transfer: Fine uniform pore structure ensures uniform heat distribution, no local overheating, protecting high-power equipment and electronic components from heat damage, extending service life.
3. Thermal Conductivity & Elasticity Balance: While maintaining high thermal conductivity, it retains good elasticity and sealing performance, can closely fit irregular heat-generating surfaces, ensuring full contact and efficient heat transfer without damaging components.
4. Thermal Management Compatibility: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-temperature insulation silicone, forming a complete thermal management solution, enabling one-stop procurement for thermal management-oriented buyers. 5. Easy Thermal Operation: 1:1 simple mixing ratio, good flowability, easy to fill into heat-generating component gaps and molds, no professional thermal management operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity and heat transfer).
2. Mix and stir thoroughly for 2-3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure thermal conductivity uniformity and product performance).
3. Pour the mixture into heat-generating component gaps or molds (paired with electronic potting compound), foam and cure at room temperature or by heating.
4. After full curing, the product forms a thermal conductive layer, quickly transferring and dissipating heat, achieving efficient thermal management.
Application Scenarios
Focus on thermal management scenarios: High-power electronic component heat dissipation (paired with electronic potting compound), industrial equipment thermal management (paired with Industrial mold silicone rubber), automotive electronic heat dissipation (paired with industrial Mold Silicone rubber), high-temperature equipment heat transfer (paired with high-temperature insulation silicone), and robot thermal management components (paired with robot silicone). It helps thermal management buyers improve equipment stability and extend service life.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, excellent thermal conductivity, meeting the thermal management procurement requirements of B2B buyers in various industries, facilitating export to global high-power equipment markets.
Customization Options
Customizable thermal conductivity (up to 4.0 W/(m·K) for high-demand scenarios), foaming ratio, viscosity and curing time, adapting to different thermal management requirements of various equipment, helping buyers optimize heat dissipation efficiency.
Production Process
High thermal conductivity-oriented production process: High-purity thermal conductive Silicone raw materials → formula optimization (enhance thermal conductivity) → precision mixing → thermal conductivity test → standardized curing → heat transfer performance inspection → packaging. Strict thermal conductivity control ensures efficient heat dissipation of each batch.
FAQ
Q1: What is the thermal conductivity range? A: 1.5-3.0 W/(m·K), efficient heat dissipation and uniform heat transfer.
Q2: Can it avoid local overheating? A: Yes, fine uniform pore structure ensures uniform heat distribution, no local overheating.
Q3: Is it suitable for high-power electronic components? A: Yes, paired with electronic potting compound, ideal for high-power electronic component heat dissipation.
Q4: Does it retain elasticity while being thermally conductive? A: Yes, maintains good elasticity, can closely fit irregular heat-generating surfaces.
Shenzhen Hong Ye Jie Technology Co., Ltd
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