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Home> Products> Foamed Silicone> Lightweight Foamed Silicone for Packaging Solutions
Lightweight Foamed Silicone for Packaging Solutions
Lightweight Foamed Silicone for Packaging Solutions
Lightweight Foamed Silicone for Packaging Solutions
Lightweight Foamed Silicone for Packaging Solutions
Lightweight Foamed Silicone for Packaging Solutions
Lightweight Foamed Silicone for Packaging Solutions

Lightweight Foamed Silicone for Packaging Solutions

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-F series

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a heat-conductive and thermal-transfer 2-component Addition Curing Silicone, featuring excellent heat conductivity (thermal conductivity ≥1.5 W/(m·K)), thermal-transfer, good heat dissipation, suitable for heat-dissipation and thermal-transfer scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS heat-conductive certification, compatible with high-temperature insulation silicone and Electronic Potting Compound, serving B2B buyers in heat-dissipation industries.
 
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a heat-conductive core product, specially developed for heat-dissipation and thermal-transfer scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with heat-conductive components (alumina, boron nitride), featuring high thermal conductivity, efficient thermal transfer, fine uniform closed-cell structure, good elasticity and heat-conductive stability. It has a thermal conductivity of ≥1.5 W/(m·K), can quickly transfer heat and dissipate excess temperature, ensuring equipment operates at a stable temperature, avoiding overheating damage. Compatible with most of our high-temperature and electronic products, it is ideal for electronic, automotive and industrial heat-dissipation scenarios.
 
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Technical Specifications
Type: 2-component addition curing silicone
Heat-Conductive Performance: Thermal conductivity ≥1.5 W/(m·K), heat-conductive, thermal-transfer, efficient heat dissipation, stable heat transfer
Foaming Feature: Fine uniform closed-cell pores (30-70μm), heat-conductive, uniform thermal distribution, no local overheating
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated rapid curing
Certifications: SGS eco-toxicity, RoHS, SGS heat-conductive certification
Key Traits: Heat-conductive, thermal-transfer, thermal conductivity ≥1.5 W/(m·K), efficient heat dissipation
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
 
Product Features & Advantages
1. Excellent Heat Conductivity: Thermal conductivity ≥1.5 W/(m·K), efficient thermal transfer, quick heat dissipation, solving the problem of traditional foaming materials’ poor heat conductivity and overheating risks.
2. Uniform Thermal Distribution: Heat-conductive components are evenly distributed, ensuring uniform heat transfer, avoiding local overheating, protecting equipment from overheating damage.
3. Heat-Conductive & Elasticity Balance: While maintaining high heat conductivity, it retains good elasticity and structural stability, no brittle fracture at high temperature, balancing heat dissipation and usability.
4. Compatibility with Heat-Dissipation Products: Compatible with HONG YE SILICONE’s high-temperature insulation silicone and electronic Potting Compound, forming a complete heat-dissipation solution, enabling one-stop procurement.
5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat-conductive components, no professional heat-conductive operation skills required, improving production efficiency.
 
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting heat-conductive performance).
2. Mix and stir thoroughly for 1-2 minutes until homogeneous, vacuum degas to remove air bubbles.
3. Pour the mixture into heat-dissipation component mold (paired with high-temperature insulation silicone), foam and cure at room temperature or by heating.
4. After full curing, the product has excellent heat conductivity, efficient heat dissipation, ready for use in heat-dissipation and thermal-transfer scenarios.
 
Application Scenarios
Focus on heat-dissipation scenarios: Electronic product heat-dissipation sealing (paired with electronic potting compound), automotive heat-dissipation components (paired with Industrial mold silicone rubber), industrial equipment heat-dissipation (paired with industrial Mold Silicone rubber), heat-conductive robot parts (paired with robot silicone), and high-temperature instrument heat transfer (paired with high-temperature insulation silicone). It helps heat-dissipation buyers ensure equipment stable operation and avoid overheating damage.
 
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Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS heat-conductive certification, excellent heat-conductive and thermal-transfer performance, meeting the heat-dissipation procurement requirements of B2B buyers in electronic, automotive and industrial industries, facilitating export to global markets.
 
Customization Options
Customizable thermal conductivity (≥2.5 W/(m·K) for high-demand scenarios), heat-transfer efficiency, foaming ratio and hardness, adapting to different heat-dissipation requirements, helping buyers optimize heat-dissipation effect.
 
Production Process
Heat-conductive-oriented production process: High-purity heat-conductive Silicone raw materials → formula optimization (add heat-conductive components) → precision mixing → heat-conductive test → standardized curing → thermal stability inspection → packaging. Strict heat-conductive testing ensures product efficient heat transfer performance.
 
FAQ
Q1: What is the thermal conductivity? A: ≥1.5 W/(m·K), efficient heat-conductive and thermal-transfer performance.
Q2: Can it dissipate heat quickly? A: Yes, quick heat transfer, efficient heat dissipation, avoiding equipment overheating.
Q3: Is it suitable for electronic product heat dissipation? A: Yes, paired with electronic potting compound, ideal for electronic product heat-dissipation sealing.
Q4: Will thermal conductivity decrease? A: No, heat-conductive performance is stable, no attenuation after long-term use.
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