Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high thermal conductivity and heat-dissipating 2-component Addition Curing Silicone, featuring excellent thermal conductivity (thermal conductivity ≥3.0 W/m·K), efficient heat dissipation, temperature control, suitable for high-heat electronic and industrial scenarios. It has fine uniform closed-cell pores, -65℃-250℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity certification, compatible with Electronic Potting Compound and high-temperature insulation silicone, serving B2B buyers in electronic and industrial heat-dissipation industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam) is a high thermal conductivity core product, specially developed for high-heat electronic, industrial heat-dissipation and temperature control scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with high thermal conductivity fillers (such as氮化硼 powder), featuring ultra-high thermal conductivity, efficient heat dissipation, fine uniform closed-cell structure, good elasticity and thermal stability. It has a thermal conductivity of ≥3.0 W/m·K, can quickly transfer and dissipate heat, effectively control temperature, solve the problem of traditional foaming materials’ poor thermal conductivity and heat accumulation. Compatible with most of our electronic and high-temperature products, it is ideal for electronic heat dissipation, industrial high-heat equipment and temperature control scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Thermal Conductivity Performance: Thermal conductivity ≥3.0 W/m·K, efficient heat dissipation, temperature control, no heat accumulation
Foaming Feature: Fine uniform closed-cell pores (30-70μm), high thermal conductivity, heat-dissipating structure, no heat blockage
Temperature Range: -65℃ to 250℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (100℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity certification
Key Traits: High thermal conductivity, heat-dissipating, thermal conductivity ≥3.0 W/m·K, temperature control
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Thermal Conductivity: Thermal conductivity ≥3.0 W/m·K, efficient heat dissipation, solving the problem of traditional foaming materials’ poor thermal conductivity and heat accumulation in high-heat scenarios.
2. Effective Temperature Control: Quickly transfers and dissipates heat, controls temperature within a safe range, extending product service life.
3. High Thermal Conductivity & Elasticity Balance: While maintaining ultra-high thermal conductivity and heat-dissipating performance, it retains good elasticity and structural stability, no brittle fracture, balancing heat dissipation and usability.
4. Compatibility with Heat-Dissipating Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-temperature insulation silicone, forming a complete heat-dissipation solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat-dissipating components, no professional heat-dissipation operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity performance).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure thermal conductivity uniformity and closed-cell structure).
3. Pour the mixture into heat-dissipating component mold (paired with electronic potting compound), foam and cure at room temperature or heated (100℃, 1h) for better heat-dissipating performance.
4. After full curing, the product has excellent thermal conductivity, can quickly dissipate heat, ready for use in high-heat electronic and industrial scenarios.
Application Scenarios
Focus on heat-dissipation scenarios: Electronic component heat dissipation (paired with electronic potting compound), industrial high-heat equipment buffers (paired with high-temperature insulation silicone), LED heat-dissipating parts (paired with high-precision Mold Silicone), heat-dissipating robot components (paired with robot silicone), and新能源 battery heat dissipation (paired with high-temperature insulation silicone). It helps heat-dissipation buyers control temperature and extend product service life.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS thermal conductivity certification, excellent high thermal conductivity and heat-dissipating performance, meeting the heat-dissipation procurement requirements of B2B buyers in electronic, industrial and new energy industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥5.0 W/m·K for high-demand scenarios), heat-dissipating efficiency, foaming ratio and hardness, adapting to different heat-dissipation requirements, helping buyers optimize temperature control effect.
Production Process
High thermal conductivity-oriented production process: High-purity thermal conductive Silicone raw materials → formula optimization (add high thermal conductivity fillers such as氮化硼 powder) → precision mixing → thermal conductivity test → heat-dissipating efficiency test → standardized curing → thermal stability inspection → packaging. Strict thermal conductivity testing ensures product efficient heat dissipation.
FAQ
Q1: What is the thermal conductivity? A: ≥3.0 W/m·K, high thermal conductivity, efficient heat dissipation.
Q2: Can it solve heat accumulation problems? A: Yes, quickly transfers and dissipates heat, effectively controlling temperature and avoiding heat accumulation.
Q3: Is it suitable for electronic components? A: Yes, paired with electronic potting compound, ideal for electronic component heat dissipation.
Q4: Will thermal conductivity decrease over time? A: No, thermal conductivity is stable, no attenuation after long-term use, ensuring long-term heat-dissipating effect.
Shenzhen Hong Ye Jie Technology Co., Ltd
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