Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high thermal conductivity and efficient heat dissipation 2-component Addition Curing Silicone, featuring excellent thermal conductivity (thermal conductivity ≥1.5 W/(m·K)), fast heat dissipation, uniform heat transfer, suitable for heat-dissipating and high-temperature scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity certification, compatible with Electronic Potting Compound and high-temperature insulation silicone, serving B2B buyers in electronic, electrical and high-temperature industrial industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high thermal conductivity heat-dissipating core product, specially developed for heat-dissipating components, high-temperature equipment and heat-transfer scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with high thermal conductivity fillers (such as aluminum nitride, boron nitride), featuring ultra-high thermal conductivity, efficient heat dissipation, fine uniform closed-cell structure, good elasticity and heat transfer stability. It has a thermal conductivity of ≥1.5 W/(m·K), can quickly transfer and dissipate heat, avoid local overheating, effectively solving the problem of traditional foaming materials’ poor thermal conductivity and slow heat dissipation in high-temperature scenarios. Compatible with most of our electronic and high-temperature products, it is ideal for heat-dissipating buffers, thermal insulation components and high-temperature heat-transfer scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Thermal Conductivity & Heat Dissipation: Thermal conductivity ≥1.5 W/(m·K), efficient heat dissipation, uniform heat transfer, heat dissipation rate ≥85%, no local overheating
Foaming Feature: Fine uniform closed-cell pores (20-50μm), thermal conductive structure, uniform heat transfer, no heat accumulation, good thermal stability
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity certification
Key Traits: High thermal conductivity, efficient heat dissipation, thermal conductivity ≥1.5 W/(m·K)
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Thermal Conductivity: Thermal conductivity ≥1.5 W/(m·K), fast heat transfer, solving the problem of traditional foaming materials’ poor heat dissipation in high-temperature scenarios.
2. Efficient Heat Dissipation: Heat dissipation rate ≥85%, effectively dissipates heat, avoids local overheating, protects equipment and components from high-temperature damage.
3. Thermal Conductive & Elasticity Balance: While maintaining ultra-high thermal conductivity and heat dissipation, it retains good elasticity and structural stability, no brittle fracture under high temperature, balancing heat dissipation and usability.
4. Compatibility with Heat-Dissipating Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-temperature insulation silicone, forming a complete heat-dissipating solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat-dissipating components, no professional heat-dissipating operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity and heat dissipation performance).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure thermal conductivity uniformity and closed-cell structure).
3. Pour the mixture into heat-dissipating component mold (paired with electronic potting compound), foam and cure at room temperature or by heating.
4. After full curing, the product has excellent thermal conductivity and heat dissipation, ready for use in heat-dissipating and high-temperature scenarios.
Application Scenarios
Focus on heat-dissipating scenarios: Electronic equipment heat-dissipating buffers (paired with electronic potting compound), high-temperature industrial heat-transfer components (paired with Industrial mold silicone rubber), electrical heat-dissipating protection (paired with high-temperature insulation silicone), heat-dissipating robot parts (paired with robot silicone), and high-temperature packaging (paired with Liquid Tank Silicone). It helps heat-dissipating buyers protect equipment from overheating and extend product service life.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS thermal conductivity certification, excellent high thermal conductivity and heat dissipation performance, meeting the heat-dissipating procurement requirements of B2B buyers in electronic, electrical and high-temperature industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥2.0 W/(m·K) for high-demand scenarios), heat dissipation rate (≥90% for high-demand scenarios), foaming ratio and hardness, adapting to different heat-dissipating and high-temperature requirements, helping buyers optimize heat transfer effect.
Production Process
Thermal conductive-oriented production process: High-purity thermal conductive Silicone raw materials → formula optimization (add high thermal conductivity fillers) → precision mixing → thermal conductivity test → heat dissipation test → standardized curing → thermal stability inspection → packaging. Strict thermal testing ensures product efficient heat transfer and heat dissipation performance.
FAQ
Q1: What is the thermal conductivity? A: ≥1.5 W/(m·K), high thermal conductivity, fast heat transfer and efficient heat dissipation.
Q2: Is it suitable for high-temperature equipment? A: Yes, temperature resistance -65℃ to 200℃, no performance degradation, ideal for high-temperature heat-dissipating scenarios.
Q3: Can it avoid local overheating? A: Yes, uniform heat transfer, heat dissipation rate ≥85%, effectively avoids local overheating of components.
Q4: Will thermal conductivity fade over time? A: No, thermal conductive fillers are evenly distributed, thermal conductivity is stable, no attenuation after long-term use.
Shenzhen Hong Ye Jie Technology Co., Ltd
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