Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a low-dielectric-constant 2-component Addition Curing Silicone, featuring excellent electrical insulation (dielectric constant ≤2.5 at 1MHz), low dielectric loss, high insulation resistance, suitable for high-frequency electronic equipment, electrical insulation and low-dielectric scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS dielectric test, compatible with Electronic Potting Compound and high-precision Mold Silicone, serving B2B buyers in electronics, electrical and high-frequency industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a low-dielectric-constant electrical insulation core product, specially developed for high-frequency electronic equipment, electrical insulation and low-dielectric scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with low-dielectric fillers and insulation modifiers, featuring low dielectric constant, low dielectric loss, fine uniform closed-cell structure, good elasticity and electrical stability. It has a dielectric constant of ≤2.5 at 1MHz, low dielectric loss (≤0.002 at 1MHz), high insulation resistance (≥10¹²Ω·cm), effectively ensuring electrical insulation and signal stability, solving the problem of traditional foaming materials’ high dielectric constant in high-frequency scenarios. Compatible with most of our electronic and electrical products, it is ideal for low-dielectric components, electrical insulation buffers and high-frequency scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Low Dielectric & Electrical Insulation: Dielectric constant ≤2.5 (1MHz), dielectric loss ≤0.002 (1MHz), insulation resistance ≥10¹²Ω·cm, breakdown voltage ≥25kV/mm, electrical stability ≥95%, no electrical performance degradation
Foaming Feature: Fine uniform closed-cell pores (20-40μm), low-dielectric structure, dense pore distribution, uniform electrical insulation, no electrical breakdown, structural integrity in high-frequency environments
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS dielectric test certification
Key Traits: Low dielectric constant (≤2.5), electrical insulation, low dielectric loss, high insulation resistance
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Low Dielectric Performance: Dielectric constant ≤2.5 at 1MHz, low dielectric loss, solving the problem of traditional foaming materials’ high dielectric constant in high-frequency electronic scenarios.
2. High Electrical Insulation: Insulation resistance ≥10¹²Ω·cm, breakdown voltage ≥25kV/mm, effectively ensuring electrical safety and signal stability in high-frequency equipment.
3. Low Dielectric & Elasticity Balance: While maintaining low dielectric constant and high insulation, it retains good elasticity and structural stability, no brittle fracture, balancing electrical performance and usability.
4. Compatibility with Electronic Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-precision mold silicone, forming a complete low-dielectric solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into low-dielectric components, no professional electrical insulation operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately in a clean, dry environment to eliminate sediment, ensure no impurities (avoid affecting dielectric performance and insulation).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure uniform dielectric constant and closed-cell structure, avoid electrical breakdown).
3. Pour the mixture into low-dielectric component mold (paired with electronic potting compound), foam and cure at room temperature or by heating (heating helps enhance electrical stability).
4. After full curing, test dielectric constant (≤2.5) and insulation resistance (≥10¹²Ω·cm) to confirm qualification, then use in high-frequency and electrical insulation scenarios.
Application Scenarios
Focus on low-dielectric scenarios: High-frequency electronic equipment insulation buffers (paired with electronic potting compound), electrical insulation parts (paired with high-precision mold silicone), low-dielectric packaging (paired with Liquid Tank Silicone), communication equipment components (paired with robot silicone), and low-dielectric robot parts (paired with robot silicone). It helps electronics industry buyers ensure signal stability and electrical safety.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS dielectric test certification, excellent low dielectric performance and electrical insulation, meeting the low-dielectric procurement requirements of B2B buyers in electronics, electrical and high-frequency industries, facilitating export to global markets.
Customization Options
Customizable dielectric constant (≤2.0 at 1MHz for high-demand scenarios), dielectric loss (≤0.001 for high-demand scenarios), foaming ratio and hardness, adapting to different high-frequency and low-dielectric requirements, helping buyers optimize electrical performance.
Production Process
Low-dielectric-oriented production process: High-purity low-dielectric Silicone raw materials → formula optimization (add low-dielectric fillers and insulation modifiers) → precision mixing → dielectric test → insulation resistance test → standardized curing → electrical stability inspection → packaging. Strict electrical testing ensures product low dielectric constant and high insulation.
FAQ
Q1: What is the dielectric constant? A: ≤2.5 at 1MHz, low dielectric loss ≤0.002, suitable for high-frequency electronic scenarios.
Q2: Is it suitable for high-frequency equipment? A: Yes, low dielectric constant ensures signal stability, ideal for high-frequency electronic equipment insulation buffers and communication components.
Q3: What is the insulation resistance? A: ≥10¹²Ω·cm, breakdown voltage ≥25kV/mm, high electrical insulation, ensuring electrical safety.
Q4: Will high temperature affect its dielectric performance? A: No, electrical stability ≥95%, dielectric constant and insulation resistance remain unchanged in -65℃-200℃, ensuring electrical performance in high-temperature scenarios.
Shenzhen Hong Ye Jie Technology Co., Ltd
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