HONG YE SILICONE Electronic Potting Compound, also known as Silicone Encapsulant and Silicone Potting Compound, is a premium two-component RTV 2 Silicone Rubber made of high-purity Silicone raw materials. It provides reliable sealing, moisture-proof, shockproof and insulation protection for circuit boards, precision electronic components and high-temperature equipment. With low viscosity, 1:1 mixing ratio, dual curing modes and strong adhesion, it helps global B2B buyers improve product stability, reduce maintenance costs and enhance efficiency, fully complying with ISO9001, UL and CE standards.
Product Overview
As a professional manufacturer of silicone raw materials and Industrial mold silicone rubber, HONG YE SILICONE offers high-performance Electronic Potting Compound —an essential solution for electronic component protection. This two-component Addition Curing Silicone consists of transparent Part A and customizable blue Part B (color adjustable per request), featuring safety, eco-friendliness and high toughness. It is the preferred choice for global B2B buyers, dedicated to potting electronic circuit boards, protecting optical electronics and precision components, integrating seamlessly with our Pad Printing Silicone and Liquid Mold Silicone for one-stop industrial silicone solutions.
Product Features & Advantages
Our Electronic Potting Compound outperforms competitors with advanced formula and strict quality control. Made of high-quality silicone raw materials, it has excellent chemical stability, moderate hardness and good elastic recovery, absorbing thermal expansion stress without cracking for long-term protection. It has low viscosity for easy pouring and full component coverage, supports room temperature (3-8 hours) and heat curing (80-100℃ for 20 minutes), adheres well to metals and plastics (PC, PP, ABS, PVC), cures without oil leakage or harmful byproducts, and boasts outstanding weather, corrosion and high-low temperature resistance.
Technical Specifications
This two-component addition curing silicone requires Part A:Part B = 1:1 (weight ratio). Mixed glue needs degassing at 0.08MPa for 3 minutes. Curing time: 3-8 hours at room temperature; 20 minutes at 80-100℃ (winter recommendation). Non-hazardous, 1-year shelf life (sealed, away from acid/alkali/impurities). Packaging: 1KG, 5KG, 20KG, 25KG, 200KG/barrel for both components, suitable for small-batch testing and large-scale production.
How to Use
1. Stir Part A and Part B separately in their containers to ensure uniformity.
2. Mix strictly at 1:1 weight ratio, stirring thoroughly for 3-5 minutes.
3. Degas mixed glue at 0.08MPa for 3 minutes, then pour into electronic components or circuit board housings.
4. Maintain specified temperature; heat at 80-100℃ for 20 minutes in winter for fast curing.
Application Scenarios
This Electronic Potting Compound brings tangible value: 30% lower maintenance costs, 25% higher qualification rate and longer electronic device service life. Main applications: circuit board potting; moisture-proof/insulation for optical electronics, LCD manufacturing and precision components; bonding/sealing of high-temperature equipment (ovens, high-temperature air filters, induction cookers). Widely used in electronic manufacturing, complementing our Electronic Encapsulation Adhesive for comprehensive protection.
Certifications and Compliance
Produced under ISO9001 quality management system, with UL and CE certifications. It meets international industrial safety standards, enabling smooth customs clearance and enhancing procurement credibility for global buyers.
Customization Options
We offer professional customization: Part B color adjustment, hardness modification and formula optimization for special environments. OEM services are available, aligning with our Mold Making Silicone capabilities to provide tailored solutions.
Production Process
Using high-quality silicone raw materials, we adopt standardized processes: pre-production sample testing, in-process inspections and pre-shipment final inspection. Advanced production lines and a professional QC team ensure stable quality and on-time delivery.
FAQ
Q: Will it damage PC/ABS plastics?
A: No, compatible with PC, PP, ABS, PVC and most metals.
Q: Why slow winter curing?
A: Heat at 80-100℃ for 20 minutes.
Q: How to store?
A: Sealed, 1-year shelf life; stir if stratified.
Q: Hazardous for shipping?
A: No.
Q: Reuse mixed glue?
A: No, use at once.
Q: Avoid which chemicals?
A: Those that inhibit curing.
Shenzhen Hong Ye Jie Technology Co., Ltd
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