High Viscosity Liquid Sealant for Electronic Components

High Viscosity Liquid Sealant for Electronic Components

Name: Liquid Tank Adhesive
Uploaded: 2026-01-28T06:43:37+08:00
Description: High viscosity easy-pouring Silicone Encapsulant from HONG YE SILICONE is specially developed for dense component

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
Picture Example	:

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Liquid Tank Adhesive

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Product Description

High viscosity easy-pouring Silicone Encapsulant from HONG YE SILICONE is specially developed for dense component electronic potting work. As core PCB encapsulation material and common LED potting adhesive, it is standard RTV2 two-component silicone rubber with fine fluidity. It adopts environment-friendly addition curing technology, no bubble residue after pouring, fully fills tiny gaps of miniature LED circuit boards and compact layout PCBs, stable bonding force, multi-material compatibility, greatly simplify electronic potting construction process.

Product Overview

This electronic potting glue is also called liquid tank Jelly Silicone Gel in filtration industry field, classic 1:1 mixing ratio brings convenient proportioning operation. Transparent main glue is convenient for internal circuit inspection after construction, matched with multi-color curing agent to meet diversified appearance demands. Its fluidity advantage is comparable to high-transparency Prototype silicone, perfectly solve the difficult filling problem of dense electronic components.

Product Features

Core advantage lies in ultra-low viscosity, flow freely into narrow gaps without manual auxiliary filling. Fast defoaming effect effectively avoid internal bubble generation affecting insulation performance. Moderate softness after curing will not squeeze miniature precise elements. It keeps stable bonding performance on metal and common engineering plastics, no shrinkage deformation after long time usage, stable and reliable daily protection performance.

Operation Instructions

Fully stir standing Silicone raw materials to restore uniform fluidity. Mix A and B materials evenly in fixed proportion, control stirring speed to reduce air mixing. Finish short-time vacuum defoaming then slowly pour along PCB edge. Select targeted curing mode according to production speed demand to finish forming quickly.

Application Scenarios

Ideal for miniature LED module, lamp strip internal circuit board, small intelligent control PCB dense element potting sealing. It is also applicable to internal filling of small liquid tank filters and precision electronic power modules, improve construction efficiency for electronic processing manufacturers.

Certifications and Compliance

Comply with electronic industry environmental protection and safety production regulations, support global small electronic product supporting export.

Customization Options

Adjust silicone viscosity range freely, match different gap sizes of electronic components for targeted fluidity optimization.

Production Process

Adopt fine grinding raw material processing technology, consistent production standard with Condensation Curing Silicone Mold Rubber, guarantee stable fluidity of finished products.

FAQ

Q: Can it fully fill gaps between dense SMT components?

A: Ultra-low viscosity flows smoothly into all tiny gaps without dead filling angle.

Q: Will bubbles appear inside after pouring?

A: Cooperate with simple defoaming operation to realize bubble-free full encapsulation easily.

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