Product Overview
This two-component electronic potting silicone includes transparent Part A and customizable colored Part B. With ultra-low viscosity and bubble-free filling performance, it avoids filling dead corners of dense PCBs and miniature components. It produces no harmful by-products during curing, matching the high-precision manufacturing standards of Rapid prototyping silicone products.
Technical Specifications
1:1 A/B weight mixing ratio; 3-minute vacuum defoaming treatment. Flexible dual curing modes for all seasons. Complete multi-size barrel packaging, 1-year sealed storage, safe non-hazardous cross-border transportation.
Product Features & Advantages
Ultra-low viscosity realizes smooth perfusion for micro gaps. Soft and elastic after curing with excellent shock absorption. Strong waterproof, moisture-proof and insulating properties. Stable chemical performance, no corrosion to precision components. Dual curing modes adapt manual and automated production lines perfectly.
How to use
1. Stir A and B components fully to eliminate layering. 2. Mix strictly at 1:1 weight proportion. 3. Conduct vacuum defoaming to remove internal air bubbles. 4. Slowly pour into precision components and cure as required.
Application Scenarios
Ideal for precision PCB encapsulation, LCD optical devices, miniature power modules and liquid tank filter fine sealing. It solves incomplete filling problems of traditional potting glue, improves finished product precision and reduces production waste.
Certifications and Compliance
Meets CE, RoHS and ISO industrial safety standards, qualified for global precision electronic product manufacturing and export.
Customization Options
Customize viscosity and fluidity to adapt different micro-gap precision components.
Production Process
Adopts refined raw material processing technology, with strict batch performance testing same as rapid prototyping silicone.
FAQ
Q: Is it suitable for dense SMT component potting?
A: Yes, ultra-low viscosity ensures full gap filling.
Q: Does bubble generation affect insulation?
A: Standard defoaming achieves bubble-free encapsulation.