Product Overview
This dual-component Jelly Silicone Gel features ultra-low viscosity for seamless micro-gap filling. It generates no curing by-products and fits multiple engineering materials. With excellent moistureproof, shockproof and insulating performance, it is widely used in precision electronics and liquid tank filter sealing scenarios, matching high-standard Rapid prototyping silicone application requirements.
Technical Specifications
Standard 1:1 mixing ratio; 3-minute vacuum defoaming. Dual room-temperature and heating curing modes. Complete multi-specification barrel packaging, 1-year sealed storage, safe non-hazardous delivery.
Product Features
Ultra-low viscosity eliminates filling dead angles for dense electronic parts. Soft elastic texture provides effective shock absorption. Stable chemical performance resists corrosion and humidity. Dual curing modes adapt manual and automated production lines. Zero oil precipitation keeps component surfaces clean.
How to Use
Stir A and B components thoroughly to avoid stratification. Mix evenly at 1:1 weight proportion. Defoam completely under vacuum condition. Slowly pour into precision components and implement targeted curing.
Application Scenarios
Perfect for LCD optical devices, miniature PCB boards, power modules and liquid tank filter fine sealing. It reduces defective products, saves raw material waste and upgrades precision electronic product quality.
Certifications and Compliance
Meets CE, RoHS and ISO industrial safety standards, suitable for global precision electronic product export manufacturing.
Customization Options
Customize fluidity and viscosity to adapt different micro-gap precision workpieces.
Production Process
Adopts refined raw material processing technology, with strict batch testing same as rapid prototyping silicone products.
FAQ
Q: Is it suitable for ultra-small component potting?
A: Yes, ultra-low viscosity achieves full penetration filling.
Q: Does defoaming affect final performance?
A: Standard defoaming ensures bubble-free and stable encapsulation effect.