How Self-Adhesive Potting Silicone Solves Transformer Insulation and Heat Dissipation Challenges
2026,08,07
Power electronics manufacturers face a persistent challenge: ensuring long-term insulation reliability and thermal management inside transformer and power supply modules. Traditional potting materials often require primers before bonding, add processing steps, and may leave voids around coil windings that compromise protection.
Hong Ye Silicone has developed a solution that addresses these pain points directly. The HY-9 Series self-adhesive Silicone Potting Compound bonds to metal cores, copper windings, plastic housings and PCB surfaces without any primer treatment. This eliminates an entire processing step from the production line, reducing both labor time and material cost.The ultra-low viscosity of the HY-9 Series is another critical advantage for transformer applications. With mixed viscosity ranging from 600 to 1400 cps depending on the model, the compound flows easily into the tight gaps between coil layers and around internal components, ensuring complete filling without voids. Air trapped in winding structures can cause partial discharge and eventual insulation failure, making thorough void-free encapsulation essential for product reliability.Thermal performance is equally important. During operation, transformers and power modules generate significant heat that must be conducted away from sensitive components. The HY-9 Series achieves thermal conductivity of no less than 0.2 W/(m.K), helping to maintain safe operating temperatures and extend product lifespan.For production efficiency, the 1:1 mixing ratio simplifies dispensing operations, and the flexible cure schedule accommodates different manufacturing workflows. Room temperature cure takes approximately 8 hours, while heat cure at 80C reduces the process to about 20 minutes for high-volume lines.Three models cover a range of requirements. HY-9300 is a zero-hardness self-adhesive gel suitable for transparent potting where visual inspection of windings is needed. HY-9400 offers an ultra-soft consistency for deep-layer filling of large power modules that demand maximum shock absorption. HY-9405 provides slightly firmer gel at 5 Shore A for applications requiring more structural support.The HY-9 Series complies with RoHS, UL, MSDS and REACH standards, with strict quality control maintained under the ISO9001 management system. Custom formulation services are available to adjust hardness, viscosity, curing speed and color for specific application needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
