HONG YE SILICONE’s Electronic Potting Compound for Laboratory Instruments is a high-precision Silicone Encapsulant tailored for sensitive lab equipment electronics. Also called Silicone Potting Compound or Electronic Encapsulation Adhesive, it cures into a stable protective layer after adding hardener, featuring waterproof, moisture-proof, thermal conductive, flame-retardant and insulation properties. With extreme temperature resistance (-60℃ to 220℃), low volatility and strong adhesion, it supports full parameter customization, complies with ISO9001, CE and UL certifications, paired with our Silicone raw materials to meet strict laboratory instrument quality and global B2B procurement requirements.
Product Overview
As a core precision-grade product of HONG YE SILICONE, our Electronic Potting Compound is engineered to protect sensitive electronic components of laboratory instruments. Different from epoxy potting resin, this high-performance silicone potting compound combines comprehensive protection and high stability, suitable for encapsulation, sealing, filling and pressure protection of lab instrument electronics. It has excellent adhesion, thermal stability and compatibility with PC, PMMA, PCB, CPU and metals (aluminum, copper, stainless steel), ensuring lab instruments operate stably in strict, corrosive lab environments. Product Features
1. High precision & stability: Low volatile content, high strength and stable performance, no deformation or performance degradation after curing, avoiding interference with lab instrument accuracy.
2. Extreme temperature adaptability: Operates stably from -60℃ to 220℃, absorbs thermal cycle stress, protects lab instrument chips and welding gold wires, adapting to extreme temperature test scenarios.
3. All-round protection: Excellent corrosion, water, moisture and dust resistance, with strong ozone and chemical erosion resistance, adapting to corrosive lab reagents and environments.
4. Strong adhesion & compatibility: Bonds perfectly to PC, PMMA, PCB, CPU and various metals, ensuring tight sealing without loosening, compatible with our Addition Curing Silicone. 5. Easy operation & customizable: Available in addition and condensation curing types, simple mixing and defoaming process; curing hardness, viscosity and operating time can be customized to match lab instrument requirements.
Technical Specifications
This electronic potting compound is made of high-quality silicone raw materials, with adjustable viscosity and cured hardness. It features extreme temperature resistance (-60℃ to 220℃), excellent thermal conductivity and flame retardancy, and high insulation performance. As an addition curing product, it can be cured at room or elevated temperature, with full curing in 24 hours (environment temperature and humidity affect curing speed). All key parameters (hardness, viscosity, operating time) can be customized to meet the precision requirements of different laboratory instruments.
Application Scenarios
Widely applied in encapsulation and protection of electronic components in various laboratory instruments, including analytical instruments, testing equipment, precision measuring tools, lab sensors, temperature controllers and CPU modules. It is suitable for chemical labs, biological labs and physical labs, effectively solving problems of lab instrument electronic damage caused by moisture, corrosion, temperature changes and vibration, ensuring accurate test results and long-term stable operation.
Core Value for Buyers
1. Ensure instrument precision: Stable performance and low volatility avoid interference with lab tests, improving instrument accuracy and product competitiveness.
2. Extend service life: Comprehensive protection against corrosion, temperature and moisture reduces lab instrument failure rate, lowering maintenance and replacement costs.
3. Strong adaptability: Customizable parameters and wide compatibility match diverse lab instrument types, meeting personalized production needs.
4. Compliance assurance: Passes international certifications, meets strict lab instrument quality standards, avoiding trade barriers for global markets.
How to Use
1. Pre-mixing: Fully stir Component A to mix settled fillers evenly, and shake Component B (hardener) thoroughly before use.
2. Mixing: Stir Component A and B in the specified weight ratio until fully fused, ensuring uniform mixing without lumps.
3. Defoaming: Put mixed glue into a vacuum container, defoam at 0.01MPa for 3 minutes, then proceed to potting to avoid bubbles affecting instrument precision.
4. Potting & curing: Pour defoamed glue into lab instrument electronic components, cure at room or elevated temperature; enter next process after basic curing, full curing in 24 hours.
Certifications and Compliance
Produced under HONG YE SILICONE’s ISO9001 quality management system, this product has passed CE and UL certifications, complying with international electronic material safety and environmental standards. It meets the strict quality requirements of laboratory instruments, ensuring compatibility with global lab equipment procurement standards.
Customization Options
We provide personalized customization for laboratory instrument production needs: adjustable cured hardness, colloid viscosity, operating time and curing speed; customizable addition/condensation curing types; special formula development for high-precision, high-corrosion-resistance lab scenarios, paired with our silicone encapsulant for one-stop solutions.
FAQ
Q1: Will it affect the precision of sensitive lab instruments? A1: No, it has low volatility and stable performance, no deformation after curing, and will not interfere with instrument precision.
Q2: Can it resist corrosive lab reagents? A2: Yes, it has excellent corrosion resistance and anti-chemical erosion performance, adapting to common corrosive lab environments.
Q3: How to store unopened potting compound? A3: Seal and store in a cool, dry place; stir evenly if layered after long storage, no impact on performance.
Q4: Can mixed glue be stored for later use? A4: No, mixed A/B components should be used up at one time to avoid curing and waste.
Q5: Is it safe to use in lab environments? A5: Yes, it is non-hazardous, meets environmental standards, no irritating odor, safe for lab production and use.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
