HONG YE SILICONE’s Electronic Potting Compound for Vending Machines (Model HY-9055) is a high-performance two-component organic Silicone Encapsulant tailored for vending machine electronic modules. It is low-viscosity, cures deeply at room temperature quickly, with excellent adhesion to PC, PP, ABS, PVC and metals. Featuring UL94-V1 flame retardancy, high insulation, thermal conductivity and waterproof performance, it fully complies with EU RoHS directives. With 1:1 mixing ratio, customizable parameters and multiple packaging options, it pairs with our Silicone raw materials and silicone encapsulant to ensure stable operation of vending machines, meeting global B2B procurement needs for commercial vending equipment.
Product Overview
As a core commercial-grade product of HONG YE SILICONE, our Electronic Potting Compound (also called Silicone Potting Compound or Electronic Encapsulation Adhesive) is a low-viscosity two-component organic silicone sealant designed for vending machine electronic modules. Different from epoxy potting resin, this product excels in room-temperature rapid curing, multi-material adhesion and long-term stability, suitable for insulation, waterproofing, sealing and fixing of vending machine electronic components. It is non-hazardous, easy to transport and store, perfectly adapting to the mass production and long-term operation needs of commercial vending machines. Product Features
1. Excellent adhesion & compatibility: Bonds perfectly to PC, PP, ABS, PVC and various metals, ensuring tight sealing of vending machine electronic modules without peeling or loosening during long-term use.
2. Efficient curing & easy operation: Low viscosity, 1:1 weight mixing ratio, simple to stir and defoam; rapid deep room-temperature curing, basic curing in 3-5 hours and full curing in 12-24 hours, matching automated production lines.
3. Reliable safety & protection: UL94-V1 flame retardancy prevents fire risks from electronic short circuits; high insulation (dielectric strength ≥25KV/mm) and thermal conductivity (≥0.4W(m.k)) ensure safe and stable operation.
4. Environmental compliance: Fully meets EU RoHS directives, non-toxic and environmentally friendly, complying with global commercial electronic product environmental standards.
5. Durable & low maintenance: Good waterproof, dust-proof and anti-aging performance; stored properly, it has a 12-month shelf life, and layered colloid can be reused after stirring, reducing waste.
Technical Specifications
Model HY-9055: Two-component liquid potting compound, 1:1 weight mixing ratio. Both A/B components are liquid, A component viscosity 3000±500mPa.s. Operating time 30-120 minutes, basic curing time 3-5 hours, full curing time 12-24 hours. Cured hardness 55±5 Shore A, thermal conductivity ≥0.4W(m.k), dielectric strength ≥25KV/mm, dielectric constant 3.0~3.3 (1.2MHz), volume resistivity ≥1.0×10¹⁶Ω.cm, flame retardancy UL94-V1. Other models and parameters are customizable.
Application Scenarios
Widely applied in potting, insulation, sealing and fixing of vending machine electronic components, including vending machine control modules, payment systems, sensor modules, power supply units and display screens. It is suitable for beverage vending machines, snack vending machines, automatic retail machines and other commercial vending equipment, effectively protecting electronics from dust, moisture and slight impact in public commercial environments.
Core Value for Buyers
1. Enhance operational stability: Multi-protection performance reduces vending machine electronic failure rate, ensuring 24/7 uninterrupted operation and increasing commercial revenue.
2. Improve production efficiency: Simple operation and rapid curing adapt to automated production, shortening production cycles and reducing labor costs.
3. Reduce costs: Reusable layered colloid, long shelf life and low maintenance needs lower material waste and after-sales costs.
4. Global compliance: Meets EU RoHS and international safety standards, avoiding trade barriers, suitable for global vending machine markets.
How to Use
1. Pre-mixing: Fully stir Component A to mix settled fillers evenly, and shake Component B thoroughly before use; stir evenly if layered after long storage.
2. Mixing: Stir Component A and B in 1:1 weight ratio until fully fused, ensuring uniform mixing without lumps.
3. Defoaming: Put mixed glue into a vacuum container, defoam at 0.08MPa for 3 minutes, then proceed to potting.
4. Curing: Pour defoamed glue into vending machine electronic modules, cure at room temperature; enter next process after basic curing, wait for full curing (12-24 hours) for optimal performance.
Certifications and Compliance
Produced under HONG YE SILICONE’s ISO9001 quality management system, this product fully complies with EU RoHS directives, meets UL94-V1 flame retardant standards and international electronic material safety requirements. It is environmentally friendly and non-hazardous, ensuring smooth import and application in global commercial markets.
Customization Options & Packaging
Customization: Adjustable cured hardness, viscosity, operating time and curing speed; custom formulas for special vending machine scenarios. Packaging: 5kg, 20kg, 25kg, 200kg, suitable for bulk B2B procurement and different production batch needs.
FAQ
Q1: Can it bond to vending machine plastic components (PP/ABS)? A1: Yes, it has excellent adhesion to PC, PP, ABS, PVC and metals, perfectly fitting vending machine electronic module materials.
Q2: What is the shelf life and storage method? A2: 12-month shelf life when sealed and stored properly; store in a cool, dry place, stir evenly if layered.
Q3: Is it easy to transport? A3: Yes, it is non-hazardous and can be transported as general chemicals, convenient for global B2B shipping.
Q4: Can mixed glue be stored for later use? A4: No, mixed A/B components should be used up at one time to avoid curing and waste.
Q5: Does it comply with EU environmental standards? A5: Yes, it fully meets EU RoHS directives, environmentally friendly and suitable for European vending machine markets.
Shenzhen Hong Ye Jie Technology Co., Ltd
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