HONG YE SILICONE’s Electronic Potting Compound for Automotive Sensors (Model HY-9055) is a two-component, 1:1 ratio low-viscosity Silicone Encapsulant, designed for automotive sensor electronic components. It features fast room-temperature deep curing, excellent adhesion to PC, PP, ABS, PVC and metals, with UL94-V1 flame retardancy, high insulation and waterproof performance. Compliant with RoHS, ISO9001 and CE certifications, it is made of high-quality Silicone raw materials, fully customizable, and supports bulk packaging, ideal for global B2B automotive electronic procurement.
Product Overview
Our Electronic Potting Compound, also known as Silicone Potting Compound and Electronic Encapsulation Adhesive, is a professional two-component organic silicone sealant tailored for automotive sensors. Unlike rigid epoxy potting resin, this product has low viscosity, fast room-temperature curing and excellent bonding performance, dedicated to protecting automotive sensor components from harsh vehicle environments. It provides reliable insulation, waterproofing, sealing and fixation, fully complying with EU RoHS directives, and is widely used in various automotive sensors, ensuring stable operation under extreme temperature and vibration conditions. Product Features
1. Fast curing performance: Enables fast deep curing at room temperature, with basic curing in 3-5 hours and full curing in 12-24 hours, adapting to automotive sensor mass production needs.
2. Superior adhesion: Excellent bonding to PC, PP, ABS, PVC and various metals, ensuring tight sealing without peeling, even under long-term automotive vibration.
3. Comprehensive protection: UL94-V1 flame retardancy, high insulation (dielectric strength ≥25 KV/mm) and waterproof performance, protecting sensors from moisture, dust and short circuits.
4. Stable thermal conductivity: Thermal conductivity ≥0.4 W(m.k), effectively dissipating heat generated by sensors during operation, avoiding overheating damage.
5. Easy operation: 1:1 weight mixing ratio, simple mixing and defoaming process, suitable for automated production lines of automotive sensors.
Technical Specifications
Model: HY-9055; Type: Two-component low-viscosity organic silicone; Mixing Ratio: 1:1 (Component A: Component B); Appearance: Liquid (both A and B); Dynamic Viscosity: 3000±500; Operating Time: 30-120 minutes; Basic Curing Time: 3-5 hours; Full Curing Time: 12-24 hours; Hardness: 55±5 Shore A; Thermal Conductivity: ≥0.4 W(m.k); Dielectric Strength: ≥25 KV/mm; Dielectric Constant (1.2MHz): 3.0~3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω.cm; Flame Retardancy: UL94-V1. Key parameters can be customized according to customer needs.
How to Use
1. Pre-mixing: Fully stir Component A to mix settled fillers evenly, and shake Component B thoroughly before use; stir evenly if layered after storage (no impact on performance).
2. Mixing: Stir Component A and B at a 1:1 weight ratio until fully fused, avoiding uneven mixing that affects performance.
3. Defoaming: Put the mixed compound into a vacuum container, degas at 0.08MPa for 3 minutes, then proceed to potting.
4. Curing: Pour into automotive sensor components, cure at room temperature; enter the next process after basic curing, and wait 12-24 hours for full curing (environment temperature and humidity affect curing speed).
Application Scenarios
Widely applied for potting, sealing, insulation and fixation of electronic components in various automotive sensors, including engine sensors, temperature sensors, pressure sensors, position sensors and speed sensors. It also suits outdoor LED display potting and general electrical module protection, providing stable performance in high-temperature, high-vibration automotive environments.
Core Value for Buyers
1. Enhance product reliability: Comprehensive protection adapts to harsh automotive environments, reducing sensor failure rate and lowering after-sales costs.
2. Improve production efficiency: 1:1 mixing ratio, fast curing and easy operation, matching automated production lines to shorten cycles.
3. Global market access: Complies with RoHS, ISO9001 and CE certifications, avoiding trade barriers for global automotive markets.
4. Cost-saving: Customizable parameters and bulk packaging options reduce procurement and production costs for large-scale orders.
Certifications and Compliance
Produced under HONG YE SILICONE’s ISO9001 quality management system, this product fully complies with EU RoHS directives, CE certification and UL94-V1 flame retardant standards. It is non-toxic, non-hazardous and environmentally friendly, meeting the strict quality requirements of automotive electronic components.
Customization & Packaging
Customization Options: Adjustable hardness, viscosity, operating time and curing speed, tailored to automotive sensor production needs; compatible with our Thermally Conductive Potting Compound and silicone encapsulant. Packaging: 5kg, 20kg, 25kg, 200kg, suitable for bulk B2B procurement. FAQ
Q1: Is this product suitable for high-temperature automotive engine sensors?
A1: Yes, it has excellent thermal stability and heat dissipation, adapting to high-temperature automotive environments.
Q2: Can it bond well to automotive plastic and metal components?
A2: Yes, it has excellent adhesion to PC, PP, ABS, PVC and various metals, ensuring tight sealing.
Q3: How to store unopened potting compound?
A3: Seal and store in a cool, dry place; shelf life is 12 months, stir evenly if layered.
Q4: Must mixed glue be used at one time?
A4: Yes, mixed A/B components should be used up at one time to avoid curing and waste.
Q5: Is it suitable for automated automotive sensor production?
A5: Yes, simple operation, 1:1 mixing ratio and fast curing, perfectly matching automated production lines.
Shenzhen Hong Ye Jie Technology Co., Ltd
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