HONG YE SILICONE’s Electronic Potting Compound is a professional Silicone Potting Compound tailored for ATM machines, also known as Electronic Encapsulation Adhesive and Silicone Encapsulant. It features waterproof, moisture-proof, thermal conductivity, flame retardancy and insulation, curing into a protective layer after mixing with a curing agent to safeguard ATM internal components. With excellent adhesion to PC, PMMA, PCB and CPU, it works stably from -60℃ to 220℃, has low volatility and high strength. As a high-qualityThermally Conductive Potting Compound, it ensures stable operation of ATM equipment, supports customization, and fully complies with international standards for global procurement needs.
Product Overview
Our Electronic Potting Compound is a high-performance silicone potting compound specially developed for ATM machines, also called potting glue or electronic silicone. It cures quickly after mixing with a curing agent to form a dense, durable protective layer, effectively isolating dust, moisture, corrosion and vibration. Designed to protect ATM core electronic components—including PCB boards, CPU modules and control panels—it ensures long-term stable operation, reduces maintenance costs, and enhances the reliability of ATM equipment, meeting the strict requirements of global ATM manufacturers and suppliers. Product Features & Advantages
- All-round protection: Excellent waterproof, moisture-proof, dust-proof, insulation, thermal conductivity and shockproof performance, fully protecting ATM internal components from harsh environments.
- Wide temperature adaptability: Stable operation from -60℃ to 220℃, absorbs internal stress caused by high-temperature cycles, protecting chips and welding gold wires from damage.
- Strong adhesion: Superior bonding to PC, PMMA, PCB, CPU and metals (aluminum, copper, stainless steel), ensuring firm encapsulation without detachment.
- High performance: Low volatile content, high strength, good ozone resistance and chemical corrosion resistance, superior to ordinary epoxy potting resin.
- Dual curing options: Available in addition curing and condensation curing types, easy to operate and compatible with mass production.
How to Use
1. Before mixing, fully stir Component A to evenly disperse the settled filler, and shake Component B thoroughly to ensure uniformity.
2. Mix Component A and Component B in the specified weight ratio (customizable according to product model and usage needs).
3. Degas if needed: Put the fully mixed glue into a vacuum container, degas at 0.01MPa for 3 minutes, then pour it into ATM components for use.
4. Cure: This is an addition curing product; cure at room temperature or high temperature. Proceed to the next process after basic curing; full curing takes 24 hours (environmental temperature and humidity affect curing effect).
Application Scenarios
This electronic potting compound is mainly used for encapsulation, sealing, filling and pressure protection of ATM internal electronic components, including control panels, PCB boards, CPU modules, sensors and connection ports. It is widely applied in commercial ATMs, self-service banking terminals and cash dispensers, providing reliable protection to ensure stable, safe operation of equipment, reduce after-sales maintenance costs, and enhance product quality for procurement customers.
Technical Specifications
- Curing Type: Addition curing (condensation curing available on request)
- Operating Temperature Range: -60℃ to 220℃
- Degassing Condition: 0.01MPa for 3 minutes (if needed)
- Full Curing Time: 24 hours (room temperature/high temperature)
- Adhesion: Excellent to PC, PMMA, PCB, CPU and common metals
- Key Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive
- Volatile Content: Low
Certifications & Compliance
Our Electronic Potting Compound is produced by HONG YE SILICONE, a manufacturer with ISO9001, UL and CE certifications. The product fully complies with international industry standards and EU RoHS directives, ensuring safety, environmental protection and reliability, meeting the strict procurement requirements of the global ATM industry.
Customization Options
We provide personalized customization services for thissilicone encapsulant. According to customer needs, we can adjust the hardness, viscosity, operating time and curing speed after curing, and customize formulas and packaging to match the production process and application scenarios of ATM machines.
FAQ
Q: Is this potting compound suitable for all ATM internal components?
A: Yes, it is specially tailored for ATM control panels, PCBs, CPU modules and other components, with excellent compatibility and protection performance.
Q: Can it meet the high-stability requirements of ATM equipment?
A: Yes, it has excellent thermal conductivity and shock resistance, ensuring stable operation of ATM components in long-term use.
Q: How to store the product properly?
A: Seal and store in a cool, dry place; if stratification occurs after long-term storage, stir evenly before use, which will not affect product performance.
Q: Is the product safe for mass production?
A: Yes, it is a non-dangerous product, easy to operate, and compatible with automated production lines to improve efficiency.
Shenzhen Hong Ye Jie Technology Co., Ltd
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