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Home> Products> Electronic Potting Compound> Electronic Potting Compound for Aerospace Avionics
Electronic Potting Compound for Aerospace Avionics
Electronic Potting Compound for Aerospace Avionics
Electronic Potting Compound for Aerospace Avionics
Electronic Potting Compound for Aerospace Avionics
Electronic Potting Compound for Aerospace Avionics
Electronic Potting Compound for Aerospace Avionics

Electronic Potting Compound for Aerospace Avionics

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9310

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Place Of Origin: China

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE Electronic Potting Compound is a professional silicone-based encapsulant designed for aerospace and avionics electronics. It offers outstanding waterproofing, thermal conductivity, flame retardancy, and high-voltage insulation. With excellent resistance to thermal shock, chemicals, and extreme temperatures from -60℃ to 220℃, it reliably protects PCBs, sensors, modules, and wiring. This addition-curing RTV silicone ensures stable performance, strong adhesion to metals and plastics, and supports room or heated curing. Fully customizable in hardness, viscosity, and working time, it meets strict aerospace electronic protection requirements.
 
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Product Overview
HONG YE SILICONE Electronic Potting Compound (also known as Silicone Potting Compound, Electronic Encapsulation Adhesive, Silicone Encapsulant) is a high-performance two-component addition-curing RTV silicone material. After mixing and curing, it forms a stable elastic colloid that provides long-term, reliable protection for aerospace and avionics electronic components.
It integrates waterproof, moisture-proof, dust-proof, anti-corrosion, thermal conductivity, flame retardancy, insulation, shock absorption, and stress relief functions. It maintains stable physical and electrical properties under long-term high-low temperature cycles, effectively protecting chips, gold wires, and circuit structures.

Product Features & Advantages

  • Wide operating temperature range: stable performance from -60℃ to 220℃
  • Excellent thermal conductivity and heat dissipation, supporting high-temperature continuous operation
  • Outstanding insulation, high pressure resistance, and anti-chemical corrosion
  • Low volatility, high bonding strength to aluminum, copper, stainless steel, PCB, and PC materials
  • Absorbs thermal cycle stress to protect internal components and extend service life
  • Low shrinkage, no corrosion to electronic parts, ideal for aerospace avionics protection

How to Use

  1. Stir Part A evenly to disperse settled fillers; shake Part B well.
  2. Mix Part A and Part B strictly according to the specified weight ratio.
  3. After mixing evenly, vacuum defoam at 0.01MPa for about 3 minutes.
  4. Pour the defoamed compound into components; cure at room temperature or with heating. Full cure completes within 24 hours.

Application Scenarios

This Electronic Potting Compound is widely used in aerospace and avionics systems:
  • PCB and circuit module protection
  • Avionics sensors and control units
  • LED display and aviation lighting modules
  • High-reliability electronic equipment sealing
  • Thermal conductive and insulation protection for precision components
It greatly improves equipment stability, safety, and service life in harsh flight environments.

Customization Options

We provide full customization for our Electronic Potting Compound:
  • Custom hardness, viscosity, and operating time
  • Adjust thermal conductivity, flame rating, and color
  • Optimize formula for automatic dispensing or manual potting
  • Support special performance requirements for aerospace-grade applications

Certifications & Compliance

Our Electronic Potting Compound strictly follows international industry standards and supports reliable testing reports. It complies with ISO9001 quality management system and meets environmental and safety requirements for aerospace electronic materials.

FAQ

Q: Is this product addition-curing or condensation-curing?
A: It is addition-curing RTV Silicone Potting Compound, with low volatility and no small molecule release.
Q: Can it be used long-term in high-altitude and extreme-temperature environments?
A: Yes, it works stably from -60℃ to 220℃, suitable for aerospace and avionics.
Q: Does it adhere well to metals and plastics?
A: Yes, excellent adhesion to aluminum, copper, stainless steel, PCB, PC, and PMMA.
Q: Can parameters be customized?
A: Yes, hardness, viscosity, curing speed, and thermal conductivity can be customized.
Q: Is it suitable for mass production lines?
A: Yes, supports room temperature and heating curing, compatible with automated potting lines.
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