HONG YE SILICONE Electronic Potting is a high-performance Thermally Conductive Potting Compound designed for fiber optic transceivers, a core Silicone raw material with UL94-V0 flame retardancy, IP65 waterproof grade and efficient thermal conductivity (≥0.8 W(m·K)). As a premiumElectronic Encapsulation Adhesive, this dual-component (1:1 ratio) Addition Curing Silicone features low viscosity, excellent fluidity and signal-friendly performance. Fully complying with ISO, CE and RoHS certifications, it reliably protects fiber optic transceiver components, ensuring low-loss signal transmission and stable long-term operation, meeting global fiber optic equipment manufacturer demands.
Product Overview
Our Electronic Potting, a professional Silicone Encapsulant, is specially engineered for fiber optic transceivers—the core component ensuring high-speed, low-loss signal transmission in optical communication systems. As a professional supplier of Silicone Potting Compound and industrial silicone solutions, we optimize this product for fiber optic scenarios: it is a low-viscosity, flame-retardant dual-component addition-curing silicone, curing at room or heated temperature (faster with higher temperature). It bonds perfectly to PC, PP, ABS, PVC and optical-grade metals, providing IP65 waterproof, dust-proof and insulation protection, while ensuring no interference to fiber optic signals, protecting transceiver components from moisture, heat and external damage. Technical Specifications
Our Electronic Potting has stable performance, with HY-9315 as a typical model (customizable parameters): dual-component Addition Curing Silicone, A/B weight ratio 1:1, liquid appearance, viscosity 500±100 cps (each component), mixed viscosity 500±100 cps. Operating time 0.5-2 hours, room-temperature curing time 4-5 hours, 80℃ curing time 20 minutes. After curing, hardness is 15±5 Shore A, thermal conductivity ≥0.8 W(m·K), dielectric strength ≥25 kV/mm, dielectric constant 3.0～3.3 (1.2MHz), volume resistivity ≥1.0×1016 Ω·cm, flame retardancy UL94-V0, linear expansion coefficient ≤2.2×10-4 m/(m·K). Packaging: 5kg, 20kg, 25kg, 200kg; shelf life 1 year (below 25℃), non-hazardous for transportation.
Product Features & Advantages
- UL94-V0 Flame Retardancy: Premium flame-retardant formula, meeting UL94-V0 standard, preventing fire risks in fiber optic transceivers, ensuring safe operation in communication equipment rooms.
- IP65 Waterproof & Moisture-Proof: Excellent sealing performance, reaching IP65 waterproof grade, effectively isolating moisture, dust and external contaminants, protecting precision transceiver components from damage.
- Efficient Thermal Conductivity: Thermal conductivity ≥0.8 W(m·K), rapidly dissipates heat generated by transceiver operation, avoiding overheating, ensuring stable signal transmission and extending service life.
- Low Viscosity & Excellent Fluidity: Low viscosity and good leveling performance, easily filling tiny gaps of fiber optic transceiver components, ensuring dense, bubble-free encapsulation without affecting signal transmission.
- Signal-Friendly & High Insulation: High insulation performance, no interference to fiber optic signals, ensuring low-loss, high-speed signal transmission; compatible with optical-grade materials.
- Flexible Curing & Customizable: Cures at room or heated temperature (faster in winter with heating), adjustable hardness, viscosity and operating time, adapting to different transceiver models and production processes.
How to Use (Step-by-Step)
- Pre-Mix Preparation: Thoroughly stir Component A and B separately in their respective containers to ensure uniform consistency; no stratification impact on performance if stirred well.
- Component Mixing: Strictly mix A and B at a 1:1 weight ratio, stir continuously until homogeneous to ensure optimal flame retardancy, thermal conductivity and curing effect.
- Vacuum Defoaming: If needed, place the mixed glue in a vacuum container and defoam at 0.08MPa for 5 minutes to remove bubbles, then pour into fiber optic transceiver components.
- Curing Process: Cure at room temperature (4-5 hours) or heat (80-100℃ for 15-20 minutes, recommended in winter). Extend curing time if the application thickness is large; ensure full curing for optimal protection.
Application Scenarios
This Electronic Potting is specifically for fiber optic transceivers, including SFP, SFP+, QSFP and XFP transceivers, widely used in data centers, optical communication networks, fiber optic switches and broadband equipment. It is suitable for encapsulating transceiver cores, circuit boards and electronic components. For fiber optic equipment purchasers, it enhances transceiver reliability, reduces failure rates from heat and moisture, ensures low-loss signal transmission, extends service life, meets international communication standards and boosts competitiveness in the global fiber optic equipment market.
Customization Options
We provide full customization for fiber optic transceiver requirements:
- Adjust curing hardness, viscosity and operating time (refer to HY-9315) to match different transceiver sizes and assembly processes.
- Optimize thermal conductivity and flame retardancy (UL94-V0) to adapt to high-speed transceiver heat dissipation needs.
- Customize A/B mixing ratio and curing speed to meet fiber optic transceiver mass production efficiency requirements.
- Provide flexible packaging specifications (5kg-200kg) to meet small-batch R&D and large-scale production supply needs.
Certifications & Compliance
Our Electronic Potting meets international optical communication equipment and industrial standards, holding ISO 9001, CE and RoHS certifications, fully complying with EU RoHS directives. It has stable batch performance, non-toxic, environmentally friendly, undergoes strict quality testing (flame retardancy, waterproof, thermal conductivity), widely trusted by global fiber optic transceiver manufacturers and suppliers.
Production Process
Our production adheres to strict industrial and optical-grade standards: selecting high-purity Silicone raw materials, precise 1:1 A/B component mixing, vacuum defoaming, strict viscosity and thermal conductivity testing, professional sealed packaging. Each batch undergoes rigorous performance testing to ensure it meets fiber optic transceiver application requirements, demonstrating our strong production capacity and quality assurance system. FAQ
Q: Is this potting suitable for high-speed fiber optic transceivers (e.g., QSFP)?
A: Yes. It has efficient thermal conductivity and signal-friendly performance, effectively dissipating heat and avoiding signal interference, ensuring stable operation of high-speed transceivers.
Q: Can it be cured quickly in winter?
A: Yes. It can be heated to 80-100℃ for 15 minutes to accelerate curing, avoiding long curing time in low-temperature environments, adapting to winter production needs.
Q: Does it affect fiber optic signal transmission?
A: No. It has excellent insulation and signal-friendly performance, no interference to fiber optic signals, ensuring low-loss, high-speed signal transmission.
Q: Can it be customized for different transceiver models?
A: Yes. We can customize viscosity, hardness and curing parameters (refer to HY-9315) to match your fiber optic transceiver model and production process.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
