HONG YE SILICONE HY-9325 is a two-component, room-temperature-vulcanizing electronic potting silicone designed for semiconductor power modules, PCBs, and electronic assemblies. It delivers reliable waterproofing, insulation, and shock absorption, supports 1:1 mixing, fast deep curing, and complies with EU RoHS. With excellent adhesion to metals, PC, ABS, and PVC, it ensures long-term stability and can be customized in hardness, viscosity, and working time for industrial encapsulation needs.
Product Overview
HY-9325 Electronic Potting Compound is a low-viscosity, two-component RTV 2 Silicone Rubber specially developed for potting and protecting semiconductor power modules, circuit boards, electrical modules, and outdoor LED displays. Also known as Silicone Encapsulant and Electronic Encapsulation Adhesive, it cures quickly at room temperature with deep crosslinking, providing stable insulation, waterproofing, and sealing performance. This Addition Curing Silicone fully meets EU RoHS environmental standards and offers strong bonding to various substrates, making it ideal for long-term electronic component protection. Key Features & Advantages
- Low viscosity and excellent flowability for full penetration into narrow gaps of power modules
- 1:1 weight ratio mixing for easy on-site operation
- Fast room-temperature curing with short handling time and high production efficiency
- Outstanding dielectric strength and volume resistivity for reliable electrical insulation
- UL94-V1 flame resistance for safe use in electronic and electrical equipment
- Excellent adhesion to metals, PC, PP, ABS, PVC and other common electronic materials
- Customizable hardness, viscosity, pot life, and curing speed to match different production processes
How to Use
- Thoroughly stir Component A to evenly distribute settled pigments, and gently shake Component B before use.
- Mix Component A and Component B at a 1:1 weight ratio.
- For bubble-free potting, place the mixed liquid in a vacuum container and degas at 0.08MPa for 3 minutes.
- Pour the degassed mixture into components and cure at room temperature. Initial curing completes within hours, with full curing in 24 hours; temperature and humidity affect curing speed.
Application Scenarios
This Silicone Potting Compound is widely used for potting semiconductor power modules, electronic circuit assemblies, LED display modules, and various electronic accessories. It provides stable waterproofing, insulation, shock resistance, and fixed sealing, effectively protecting core components from moisture, dust, vibration, and thermal stress. It is highly compatible with Industrial mold silicone rubber and Rapid prototyping silicone production lines. Technical Specifications
Before curing, both parts appear as viscous liquids with a viscosity of approximately 500±100 cps. The mixed system offers 30–120 minutes of working time, surface curing in 3–5 minutes, and full curing in 24 hours. Cured silicone reaches 25±2 Shore A hardness, thermal conductivity ≥0.2 W/(m·K), dielectric strength ≥25 kV/mm, dielectric constant 3.0–3.3, and volume resistivity ≥1.0×10¹⁶ Ω·cm, with UL94-V1 flame resistance.
Certifications & Compliance
HY-9325 electronic potting silicone complies with EU RoHS directives. Our products are supported by our factory’s ISO9001, CE, and UL certifications, ensuring stable quality for global industrial and electronic applications.
Customization Options
We provide full customization for this Potting Compound , including adjusted hardness, viscosity, working time, and curing speed. As a professional Mold Making Silicone and liquid silicone manufacturer, we also support tailored formulations for semiconductor power module assembly and special encapsulation environments. Notes
- Store sealed and use mixed material in one batch to avoid waste.
- Non-hazardous but avoid contact with eyes and mouth; rinse with water if accidental contact occurs.
- Stir well if layering occurs during storage; this does not affect performance.
FAQ
Q: Is this potting silicone suitable for semiconductor power module protection? A: Yes, its low viscosity, high insulation, and thermal stability make it ideal for potting semiconductor power modules and electronic assemblies.
Q: Can the curing time and hardness be adjusted? A: Yes, we can customize curing speed, hardness, viscosity, and pot life according to your production requirements.
Q: What packaging options are available? A: We offer steel drums in 5kg, 20kg, 25kg, 200kg and plastic drums of 20kg to meet bulk purchasing needs.
Q: How long is the shelf life? A: The shelf life is one year under sealed storage; it can be transported as a general chemical.
Shenzhen Hong Ye Jie Technology Co., Ltd
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