Product Overview
Our Flame-Retardant Electronic Potting Silicone, also called silicone encapsulant and Electronic Potting Compound, is a professional two-component liquid silicone (Component A and B) tailored for quantum computing systems. As a leading Mold Making Silicone and liquid silicone manufacturer, we design this product to meet the strict high-precision requirements of quantum computing, providing comprehensive encapsulation, sealing and fixation for sensitive electronic components. It cures at room or elevated temperatures, forming a stable flame-retardant system that ensures the safe and stable operation of quantum computing modules. Key Features & Advantages
1. Quantum-compatible stability: Cures without exotherm, low shrinkage and no corrosion, avoiding interference with quantum computing precision.
2. Excellent flame retardancy: Forms a reliable flame-retardant system, reducing fire risks in quantum computing equipment.
3. Superior insulation & environmental resistance: Waterproof, moisture-proof, mold-proof and dust-proof, with excellent chemical resistance, weather aging resistance and yellowing resistance.
4. Wide temperature adaptability: Maintains elasticity in a wide temperature range, ensuring stable performance in quantum computing working environments.
How to Use
1. Before mixing, fully stir Component A and Component B separately in their respective containers to ensure uniformity.
2. Mix Component A and Component B at a 1:1 weight ratio, stirring evenly.
3. Degas the mixed adhesive at 0.08MPa for 3 minutes to remove air bubbles.
4. Cure at room temperature or heat to accelerate curing; curing speed is temperature-dependent—proper heating is recommended in low-temperature environments (e.g., winter) to speed up vulcanization.
Application Scenarios
This flame-retardant Silicone Potting Compound is mainly used for encapsulation, sealing, casting and fixation of electronic components in quantum computing systems, including quantum computing modules, PCB substrates, power modules and control units. It is also suitable for auxiliary encapsulation of related precision electronic parts, ensuring waterproof, insulation and flame-retardant protection. It can be used with Rapid prototyping silicone to produce quantum computing component prototypes, accelerating R&D efficiency for high-tech manufacturers, while reducing maintenance costs and improving equipment reliability. Technical Specifications
Our flagship model HY-9045 is an addition curing silicone with a 1:1 mixing ratio. Both components are liquid with a viscosity of 2500±500 Pa.s. At 25℃, it has an operating time of 30-60 minutes; curing takes 4-5 hours at 80℃. After curing, it reaches 45±5 Shore A hardness, with dielectric strength ≥25 kv/m, dielectric constant 3.0 (1.2MHz) and volume resistivity ≥1×10¹⁵ Ω. Other models and parameters can be customized according to quantum computing system requirements.
Certifications & Compliance
Our Flame-Retardant Electronic Potting Silicone meets international high-tech equipment standards, backed by our factory’s ISO9001, CE and UL certifications. It undergoes strict quality testing to ensure compliance with the high-precision, flame-retardant and low-interference requirements of quantum computing systems, gaining recognition from global high-tech manufacturers.
Customization Options
We provide high-precision customization services. According to quantum computing system requirements, we can adjust curing hardness, viscosity, operating time and curing speed. As a professional manufacturer of silicone Potting Compound and liquid silicone, we also customize formulations to enhance flame retardancy and reduce interference, adapting to the strict working environment of quantum computing.
Packaging, Storage & Transportation
Packaging specifications: 5kg, 20kg, 25kg and 200kg. Storage: Sealed storage, shelf life of 1 year at below 25℃; stratification may occur during storage, stir evenly before use (does not affect performance). Transportation: Non-hazardous, can be transported as general chemicals.
Notes
1. Seal and store the silicone; use mixed adhesive at one time to avoid waste.
2. Non-hazardous, but avoid contact with eyes and mouth; rinse with water if accidental contact occurs.
3. Avoid contact with substances that inhibit curing: organotin compounds, sulfur, sulfides, amines, incompletely cured condensation silicone, amine-cured epoxy resin and solder flux.
FAQ
Q: Is this product suitable for quantum computing systems?
A: Yes, it has low shrinkage, no exotherm and no interference, perfectly adapting to the high-precision requirements of quantum computing components.
Q: What is the mixing ratio of Component A and B?
A: The standard ratio is 1:1 by weight, ensuring stable curing and performance.
Q: Can it be customized for quantum computing’s special requirements?
A: Yes, we can adjust hardness, viscosity, curing speed and flame-retardant performance to meet your specific needs.
Q: Does it affect quantum computing precision?
A: No, it cures without corrosion or high shrinkage, and has ultra-low volatile content, avoiding any interference with quantum computing.
Q: What is the shelf life and storage requirement?
A: Shelf life is 1 year at below 25℃; store sealed, and stir evenly if stratification occurs.
Shenzhen Hong Ye Jie Technology Co., Ltd
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