Product Overview
Our Transparent Electronic Potting Silicone is a high-performance two-component potting material tailored for hyperspectral imaging sensors, designed to encapsulate sensor cores, lenses, circuit boards and sensitive electronic components. As a leading Mold Making Silicone and liquid silicone manufacturer, we craft this product to meet the strict high-transparency, low-interference and UV-resistant requirements of hyperspectral imaging. It serves as an ideal encapsulation material for sensor components, ensuring unobstructed light transmission and reliable protection, while maintaining the sensor’s imaging accuracy. Key Features & Advantages
1. Ultra-high light transmittance: 95% transmittance at 450nm (2mm thickness) and refractive index of 1.41, ensuring no interference with hyperspectral light transmission and maintaining imaging accuracy.
2. Excellent UV resistance: Withstands long-term UV exposure without yellowing or light decay, adapting to outdoor hyperspectral imaging scenarios.
3. Environmentally friendly: Solvent-free addition curing silicone, non-polluting, complying with international environmental standards.
4. Wide temperature adaptability: Operates stably from -50℃ to 250℃, suitable for extreme temperature environments of hyperspectral sensors. 5. Superior fluidity: Easily fills tiny gaps of sensor components, enabling rapid deep curing; made of high-purity Silicone raw materials, consistent with our Platinum cured mold silicone quality control, superior to epoxy potting resin in transparency and flexibility. How to Use
1. Mix Component A and B in a dry container at a 1:1 weight ratio, stir evenly, then let stand to defoam or remove bubbles by vacuum.
2. Clean the hyperspectral imaging sensor components to be encapsulated, dry them thoroughly (ensure the sensor core is dry before encapsulation), then pour the mixed adhesive to fully infiltrate the components.
3. Place the encapsulated sensor into an oven for curing; adjust the curing speed by changing the temperature to match the sensor manufacturing process.
Application Scenarios
This high transparency Mold Silicone is mainly used for encapsulation of hyperspectral imaging sensors, including sensor cores, lenses, circuit boards and stabilizers. It is also suitable for encapsulation of high-power LEDs, SMD LEDs and lens filling related to hyperspectral imaging systems. It ensures clear light transmission, protects sensor components from moisture, dust and external impact, improves imaging stability and extends sensor service life. It can be used with Rapid prototyping silicone to produce hyperspectral sensor prototypes, accelerating R&D efficiency for imaging equipment manufacturers. Technical Specifications
Our flagship model HY-9320 is an addition curing silicone with a 1:1 weight ratio; both components are colorless transparent liquids with a viscosity of 500±100 mPa.s. After curing, it reaches 20±3 Shore A hardness, 1.41 refractive index, 95% transmittance at 450nm (2mm), volume resistivity of 1.0×10¹⁵ Ω.cm and CTE of 280 ppm/℃. Key parameters including curing hardness, viscosity and operating time can be fully customized according to hyperspectral imaging sensor requirements.
Certifications & Compliance
Our Transparent Electronic Potting Silicone meets international imaging equipment industry standards, backed by our factory’s ISO9001, CE and UL certifications. It is solvent-free, environmentally friendly and undergoes strict quality testing (including light transmittance, UV resistance and temperature resistance tests) to ensure compliance with the high-precision requirements of hyperspectral imaging sensors, gaining recognition from global imaging equipment manufacturers.
Customization Options
We provide imaging-grade customization services. According to hyperspectral imaging sensor requirements, we can adjust curing hardness, viscosity, operating time, transmittance and refractive index. As a professional manufacturer of silicone Potting Compound and liquid silicone, we also customize formulations to enhance UV resistance and light transmission, adapting to the specific working environments of hyperspectral imaging.
Packaging, Storage & Notes
Storage: Store in a cool and dry place, shelf life of 12 months; both Component A and B must be sealed, re-cap after opening to avoid moisture contact.
Transportation: Non-hazardous, can be transported as general chemicals.
Notes: 1. Avoid contact with oxygen, phosphorus, sulfur, peroxides and metal compounds (lead, tin, cadmium) to prevent curing failure.
2. Non-hazardous, but avoid contact with eyes and mouth; rinse with water if accidental contact occurs.
FAQ
Q: Is this product suitable for hyperspectral imaging sensors?
A: Yes, it has ultra-high transmittance and low interference, perfectly maintaining the imaging accuracy of hyperspectral sensors.
Q: What is its light transmittance?
A: 95% transmittance at 450nm (2mm thickness), ensuring unobstructed light transmission.
Q: Can it resist UV radiation?
A: Yes, it has excellent UV resistance, no yellowing or light decay under long-term UV exposure.
Q: Can it be customized for sensor requirements?
A: Yes, we can adjust transmittance, refractive index, hardness and other parameters to meet your specific needs.
Q: How to store this product properly?
A: Store in a cool dry place, sealed, shelf life 12 months; avoid moisture and incompatible chemicals.
Shenzhen Hong Ye Jie Technology Co., Ltd
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