HONG YE SILICONE Electronic Potting Silicone, also known as Potting Compound , electronic glue and Silicone Encapsulant, is a high-precision two-component material customized for quantum computing systems. It integrates waterproof, moisture-proof, thermal conductivity, flame retardancy and insulation; after adding curing agent, the liquid colloid cures into shape to protect sensitive electronic components. As a premium silicone encapsulant, it operates stably from -60℃ to 220℃, has ultra-low volatile content and high adhesion, supporting full customization to meet the strict requirements of quantum computing systems.
Product Overview
Our Electronic Potting Silicone is a professional two-component potting material tailored for quantum computing systems, available in Addition Curing Silicone and Condensation Curing Silicone Mold Rubber. As a leading Mold Making Silicone and liquid silicone manufacturer, we design this product to meet the high-precision, low-interference requirements of quantum computing, providing comprehensive encapsulation, sealing, filling and pressure protection for sensitive electronic components. It bonds excellently with PC, PMMA, PCB, CPU and metals like aluminum, copper and stainless steel, ensuring long-term stable operation of quantum computing modules. Key Features & Advantages
1. Quantum-compatible stability: Ultra-low volatile content, high strength and low shrinkage, avoiding interference with quantum computing precision.
2. Comprehensive protection: Excellent corrosion resistance, waterproof, moisture-proof, dust-proof, shockproof and flame retardancy, with good ozone and chemical erosion resistance.
3. Wide temperature adaptability: Operates stably from -60℃ to 220℃, absorbing internal stress from high-temperature cycles to protect chips and welding gold wires.
4. Strong adhesion: Bonds well with PC, PMMA, PCB and various metals, ensuring firm encapsulation.
How to Use
1. Before mixing, fully stir Component A to evenly distribute settled fillers, and shake Component B thoroughly to ensure uniformity.
2. Mix Component A and B according to the specified weight ratio for quantum computing precision requirements.
3. Degas as needed: Stir the mixed adhesive evenly, place in a vacuum container, degas at 0.01MPa for 3 minutes, then pour for use.
4. This addition curing silicone product can be cured at room temperature or heated; proceed to the next process after initial curing, with full curing in 24 hours. Ambient temperature and humidity significantly affect curing speed, so strict control is recommended.
Application Scenarios
This Silicone Potting Compound is mainly used for encapsulation, sealing, filling and pressure protection of electronic components in quantum computing systems, including quantum computing modules, PCB substrates, power modules and control units. It ensures stable operation of components in precision working environments, reduces failure risks and improves equipment reliability. It can be used with Rapid prototyping silicone to produce quantum computing component prototypes, accelerating R&D efficiency for high-tech manufacturers and reducing production costs. Technical Specifications
Available in addition curing and condensation curing types, it is a liquid colloid with good fluidity before curing. It operates stably from -60℃ to 220℃, with excellent thermal conductivity, insulation and flame retardancy. Key parameters including curing hardness, viscosity and operating time can be fully customized according to the specific requirements of quantum computing systems, ensuring perfect adaptation to different working conditions.
Certifications & Compliance
Our Electronic Potting Silicone meets international high-tech equipment standards, backed by our factory’s ISO9001, CE and UL certifications. It undergoes strict quality testing to ensure compliance with the high-precision, low-interference and flame-retardant requirements of quantum computing systems, gaining recognition from global high-tech manufacturers.
Customization Options
We provide high-precision customization services. According to quantum computing system requirements, we can adjust curing hardness, viscosity, operating time and curing speed. As a professional manufacturer of silicone potting compound and liquid silicone, we also customize formulations to enhance thermal conductivity and reduce interference, adapting to the strict working environment of quantum computing.
Notes
1. Seal and store the silicone; use mixed adhesive at one time to avoid waste.
2. Non-hazardous, but avoid contact with eyes and mouth; rinse with water immediately or seek medical attention if accidental contact occurs.
3. After long-term storage, the colloid may stratify; stir evenly before use, which does not affect product performance.
FAQ
Q: Is this product suitable for quantum computing systems?
A: Yes, it has high precision, low interference and wide temperature adaptability, perfectly adapting to the strict requirements of quantum computing components.
Q: What materials can it bond with?
A: It bonds excellently with PC, PMMA, PCB, CPU and metals like aluminum, copper and stainless steel.
Q: Can it be customized for special requirements?
A: Yes, we can adjust hardness, viscosity, operating time and other parameters to meet your specific needs.
Q: What is its operating temperature range?
A: It operates stably from -60℃ to 220℃, adapting to extreme temperature environments.
Q: How to store this product properly?
A: Store it in a sealed container at room temperature; stir evenly if stratification occurs, which does not affect performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
