HONG YE SILICONE Electronic Potting Silicone, also known as Potting Compound , electronic glue and Silicone Encapsulant, is a professional two-component material customized for Brain-Computer Interfaces (BCI). It integrates waterproof, moisture-proof, thermal conductivity, flame retardancy and insulation; after adding curing agent, the liquid colloid cures into shape to protect sensitive BCI electronic components. As a premium silicone encapsulant, it operates stably from -60℃ to 220℃, has ultra-low volatile content and high adhesion, supporting full customization to meet the strict high-precision and biocompatibility requirements of BCI systems.
Product Overview
Our Electronic Potting Silicone is a high-performance two-component potting material tailored for Brain-Computer Interfaces (BCI), designed to protect PCB boards, BCI control modules, signal sensors and core electronic components. As a leading Mold Making Silicone and liquid silicone manufacturer, we craft this product to meet the strict low-interference, biocompatibility and precision requirements of BCI devices. It provides comprehensive encapsulation, sealing, filling and pressure protection for sensitive electronic components, forming a reliable thermal conductive and insulating system to ensure stable signal transmission and operation of BCI systems. Key Features & Advantages
1. BCI-compatible stability: Ultra-low volatile content, no harmful outgassing, avoiding interference with BCI signal transmission and ensuring biocompatibility.
2. Comprehensive protection: Excellent corrosion resistance, waterproof, moisture-proof, dust-proof, shockproof and flame retardancy, with good ozone and chemical erosion resistance, adapting to medical and research environments.
3. Extreme temperature resistance: Operates stably from -60℃ to 220℃, absorbing internal stress from temperature changes to protect chips and welding gold wires, ensuring long-term BCI reliability.
4. Strong adhesion: Bonds excellently with PC, PMMA, PCB and medical-grade metals (aluminum, copper, stainless steel), ensuring firm encapsulation.
How to Use
1. Before mixing, fully stir Component A to evenly distribute settled fillers, and shake Component B thoroughly to ensure uniformity.
2. Mix Component A and B according to the specified weight ratio for BCI precision requirements.
3. Degas as needed: Stir the mixed adhesive evenly, place in a vacuum container, degas at 0.01MPa for 3 minutes, then pour for use.
4. This Addition Curing Silicone product can be cured at room temperature or heated curing, proceed to the next process after initial curing, with full curing in 24 hours. Ambient temperature and humidity significantly affect curing speed, so strict control is recommended for BCI component manufacturing. Application Scenarios
This Silicone Potting Compound is mainly used for encapsulation, sealing, filling and pressure protection of electronic components in Brain-Computer Interfaces (BCI), including BCI PCB boards, control modules, signal sensors, data transmission units and electrode connectors. It ensures stable operation of BCI devices in medical research and clinical environments, reduces signal interference, improves data accuracy and extends service life. It can be used with Rapid prototyping silicone to produce BCI component prototypes, accelerating R&D efficiency for medical device manufacturers and reducing production costs. Technical Specifications
Available in addition curing and Condensation Curing Silicone Mold Rubber types, it is a liquid colloid with good fluidity before curing. It operates stably from -60℃ to 220℃, with excellent thermal conductivity, insulation, flame retardancy and low-interference performance. Key parameters including curing hardness, viscosity and operating time can be fully customized according to the specific requirements of BCI systems, ensuring perfect adaptation to medical and research working conditions. Certifications & Compliance
Our Electronic Potting Silicone meets international medical device industry standards, backed by our factory’s ISO9001, CE and UL certifications. It undergoes strict quality testing (including low-interference, biocompatibility and thermal stability tests) to ensure compliance with the high-reliability and precision requirements of BCI systems, gaining recognition from global medical device manufacturers.
Customization Options
We provide medical-grade customization services. According to BCI system requirements, we can adjust curing hardness, viscosity, operating time and curing speed. As a professional manufacturer of silicone potting compound and liquid silicone, we also customize formulations to enhance low-interference performance and biocompatibility, adapting to the strict working environment of BCI devices.
Notes
1. Seal and store the silicone; use mixed adhesive at one time to avoid waste.
2. Non-hazardous, but avoid contact with eyes and mouth; rinse with water immediately or seek medical attention if accidental contact occurs.
3. After long-term storage, the colloid may stratify; stir evenly before use, which does not affect product performance or BCI compatibility.
FAQ
Q: Is this product suitable for Brain-Computer Interfaces (BCI)?
A: Yes, it has ultra-low outgassing, low interference and biocompatibility, perfectly adapting to the strict requirements of BCI components.
Q: What materials can it bond with?
A: It bonds excellently with PC, PMMA, PCB and medical-grade metals like aluminum, copper and stainless steel.
Q: Can it be customized for BCI application requirements?
A: Yes, we can adjust hardness, viscosity, operating time and low-interference performance to meet your specific BCI needs.
Q: Does it interfere with BCI signal transmission?
A: No, it has ultra-low volatile content and low interference, ensuring stable BCI signal transmission and data accuracy.
Q: How to store this product properly?
A: Store it in a sealed container at room temperature; stir evenly if stratification occurs, which does not affect performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
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