Product Overview
This high-end Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as reliable industrial Silicone raw materials for precision impedance matching circuit packaging. It offers excellent adhesion and thermal stability for PCB, CPU, PC, PMMA and various metal substrates including aluminum and copper. The cured silicone features uniform internal structure, zero dielectric fluctuation, effectively locking circuit impedance parameters, absorbing thermal cycling stress, and protecting core chips and bonding gold wires.
Core Product Features & Advantages
Specially customized for matched impedance circuits, it solves the common defect of impedance drift caused by ordinary potting materials:
1. Stable impedance matching performance: Consistent dielectric properties prevent signal impedance deviation, ensuring precise and stable signal transmission of precision circuits.
2. Multi-dimensional protective performance: Integrates waterproof, moisture-proof, dust-proof, shockproof and anti-corrosion functions, with excellent ozone and chemical erosion resistance.
3. Ultra-wide temperature adaptability: Stably operates at -60℃ to 220℃, maintains fixed impedance parameters during long-term high and low temperature cycling.
4. Low volatility & high adhesion: Ultra-low volatile content and high structural strength, firmly bonds multiple materials without affecting circuit electrical parameters.
Application Scenarios
Widely used for encapsulation and protection of impedance matching circuits, high-precision signal circuits, RF matching modules and communication precision circuit boards. Applicable to communication equipment, precision instrumentation and intelligent electronic devices. It effectively avoids signal mismatch and transmission failure, improves circuit operation accuracy and product yield, and reduces manufacturers’ debugging and after-sales costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly to ensure formula uniformity.
2. Proportional mixing: Strictly follow standard AB weight ratio to guarantee stable dielectric and impedance matching performance.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3-minute defoaming to prevent internal bubbles causing impedance instability.
4. Curing treatment: Adopt room temperature or heating curing. Subsequent processes can be carried out after initial curing, with full curing completed within 24 hours.
Certifications & Compliance
Our products pass ISO9001, CE, UL and ROHS international certifications. Fully compliant with global precision electronic industry standards, they support export and high-end industrial impedance matching circuit packaging applications.
Customization Options
We provide professional OEM customization. Viscosity, hardness, operating time and curing speed can be adjusted to fit different impedance matching circuit packaging processes.
Production & Quality Control
We adopt standardized production and strict full-process QC system. Pre-production sample testing and pre-shipment full inspection ensure stable impedance performance and consistent batch quality.
FAQ
Q1: Will this potting silicone affect circuit impedance matching? A: No. It features ultra-stable dielectric properties with zero impedance drift, perfectly protecting matched impedance circuits.
Q2: Does colloidal stratification influence precision circuit performance? A: Slight stratification is normal after long storage. Even stirring will not damage its stable electrical and protective performance.
Q3: How to store the impedance matching Potting Compound? A: Keep sealed and dry. Mixed AB silicone should be used up at one time to avoid performance attenuation.